18492402. PACKAGE COMPRISING INTEGRATED DEVICES AND BRIDGE COUPLING TOP SIDES OF INTEGRATED DEVICES simplified abstract (QUALCOMM Incorporated)

PACKAGE COMPRISING INTEGRATED DEVICES AND BRIDGE COUPLING TOP SIDES OF INTEGRATED DEVICES

Organization Name

QUALCOMM Incorporated

Inventor(s)

Bharani Chava of San Diego CA (US)

Abinash Roy of San Diego CA (US)

Stanley Seungchul Song of San Diego CA (US)

Jonghae Kim of San Diego CA (US)

PACKAGE COMPRISING INTEGRATED DEVICES AND BRIDGE COUPLING TOP SIDES OF INTEGRATED DEVICES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18492402 titled 'PACKAGE COMPRISING INTEGRATED DEVICES AND BRIDGE COUPLING TOP SIDES OF INTEGRATED DEVICES

Simplified Explanation

The abstract describes a package comprising a substrate, two integrated devices coupled to the substrate through solder interconnects, and bridges providing electrical paths between the integrated devices.

• Package includes substrate, integrated devices, and bridges with solder interconnects.
• First bridge connects first and second integrated devices through solder interconnects.
• Second bridge also connects first and second integrated devices through solder interconnects.

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1. 1. 1. Potential Applications

• High-performance computing
• Telecommunications equipment
• Automotive electronics

1. 1. 1. Problems Solved

• Improved electrical connectivity between integrated devices
• Enhanced reliability of connections
• Increased efficiency of signal transmission

1. 1. 1. Benefits

• Higher performance of electronic systems
• Greater durability and longevity of components
• Enhanced overall functionality of devices

Original Abstract Submitted

A package comprising a substrate; a first integrated device coupled to the substrate through at least a first plurality of solder interconnects; a second integrated device coupled to the substrate through at least a second plurality of solder interconnects; a first bridge coupled to the first integrated device and the second integrated device through at least a third plurality of solder interconnects, wherein the first bridge is configured to provide at least one first electrical path between the first integrated device and the second integrated device, and wherein the first bridge is coupled to a top portion of the first integrated device and a top portion of the second integrated device, through at least the third plurality of solder interconnects; and a second bridge coupled to the first integrated device and the second integrated device through a fourth plurality of solder interconnects.