18488710. SEMICONDUCTOR MODULE simplified abstract (Robert Bosch GmbH)

SEMICONDUCTOR MODULE

Organization Name

Robert Bosch GmbH

Inventor(s)

Felix Stewing of Steinheim (DE)

SEMICONDUCTOR MODULE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18488710 titled 'SEMICONDUCTOR MODULE

Simplified Explanation

The semiconductor module described in the patent application integrates a semiconductor switch and a capacitor component, with the capacitor component featuring a lateral finger structure and including a semiconductor substrate, first electrodes, and second electrodes.

• The capacitor component has a lateral finger structure.
• The capacitor component includes a semiconductor substrate, first electrodes, and second electrodes.
• The first electrodes and second electrodes have identical basic forms and are formed alternatingly next to one another at a predefined distance within and/or on the semiconductor substrate.
• The first electrodes and second electrodes are configured to be contacted individually from outside the capacitor component via respective contacting regions.
• At least a portion of the first electrodes and second electrodes is electrically connected via respective contacting regions of the capacitor component to respective contacting regions of the semiconductor switch.
• The capacitor component and the semiconductor switch are integrated into the semiconductor module.

Potential Applications

The technology described in this patent application could be applied in power electronics, renewable energy systems, electric vehicles, and industrial automation.

Problems Solved

This technology solves the problem of efficiently integrating a semiconductor switch and a capacitor component within a semiconductor module, improving overall performance and reliability.

Benefits

The integration of the capacitor component and semiconductor switch leads to a more compact and efficient semiconductor module, reducing space requirements and enhancing system performance.

Potential Commercial Applications

The technology could find commercial applications in the development of advanced power electronics systems for various industries, including automotive, renewable energy, and industrial automation.

Possible Prior Art

One possible prior art could be the integration of capacitors and semiconductor switches in power electronics modules, but the specific configuration and design of the capacitor component with a lateral finger structure may be unique to this patent application.

How does this technology compare to existing semiconductor module designs in terms of efficiency and performance?

This article does not provide a direct comparison with existing semiconductor module designs to evaluate the efficiency and performance improvements offered by the described technology.

What are the potential challenges in implementing this integrated semiconductor module in practical applications?

The article does not address the potential challenges that may arise during the implementation of this integrated semiconductor module in real-world applications, such as manufacturing complexities or compatibility issues with existing systems.

Original Abstract Submitted

A semiconductor module. The semiconductor module includes: at least one semiconductor switch and a capacitor component, wherein the capacitor component has a lateral finger structure and includes a semiconductor substrate, at least two first electrodes, at least two second electrodes. The first electrodes and the second electrodes respectively have identical basic forms and are formed alternatingly next to one another at a predefined distance within and/or on the semiconductor substrate and are configured to be contacted individually from outside the capacitor component via respective contacting regions. At least a portion of the first electrodes and of the second electrodes is electrically connected via respective contacting regions of the capacitor component to respective contacting regions of the semiconductor switch, and the capacitor component and the semiconductor switch are integrated into the semiconductor module.