18487247. SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCTOR PACKAGES
Organization Name
Inventor(s)
Eunsuk Jung of Hwaseong-si (KR)
Kwangjin Moon of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18487247 titled 'SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCTOR PACKAGES
Simplified Explanation
The abstract of this patent application describes a semiconductor package that consists of multiple semiconductor chips stacked on top of each other. The backside of the third semiconductor chip's substrate can be arranged to face either the backside surface or the front surface of the second semiconductor chip's substrate. In both cases, the third substrate and the second insulation layer on the second substrate are directly bonded to each other.
- The semiconductor package includes multiple semiconductor chips stacked sequentially.
- The backside of the third semiconductor chip's substrate can be arranged to face either the backside or the front surface of the second semiconductor chip's substrate.
- In one arrangement, the third substrate and the second backside insulation layer are directly bonded to each other.
- In the other arrangement, the third substrate and the second front insulation layer are directly bonded to each other.
Potential Applications:
- This technology can be used in the manufacturing of advanced semiconductor devices.
- It can be applied in the development of high-performance integrated circuits.
- The semiconductor package can be utilized in various electronic devices such as smartphones, computers, and automotive electronics.
Problems Solved:
- The technology enables efficient stacking of multiple semiconductor chips, optimizing space utilization.
- It provides a direct bonding method between the substrates and insulation layers, ensuring better electrical and thermal conductivity.
- The arrangement options allow for flexible design and integration of different semiconductor chips.
Benefits:
- Improved performance and functionality of semiconductor devices.
- Enhanced reliability and durability due to direct bonding between layers.
- Compact and space-efficient design, enabling smaller and thinner electronic devices.
Original Abstract Submitted
A semiconductor package includes first to fourth semiconductor chips sequentially stacked on one another. A backside of a third substrate of the third semiconductor chip may be arranged to face a backside surface of a second substrate of the second semiconductor chip such that the third substrate and a second backside insulation layer provided on the backside surface of the second substrate are bonded directly to each other, or the backside of the third substrate may be arranged to face a front surface of the second substrate such that the third substrate and a second front insulation layer provided on the front surface of the second substrate are bonded directly to each other.
