18486950. SEMICONDUCTOR DEVICES WITH REDISTRIBUTION STRUCTURES CONFIGURED FOR SWITCHABLE ROUTING simplified abstract (Micron Technology, Inc.)

SEMICONDUCTOR DEVICES WITH REDISTRIBUTION STRUCTURES CONFIGURED FOR SWITCHABLE ROUTING

Organization Name

Micron Technology, Inc.

Inventor(s)

Travis M. Jensen of Boise ID (US)

David R. Hembree of Boise ID (US)

SEMICONDUCTOR DEVICES WITH REDISTRIBUTION STRUCTURES CONFIGURED FOR SWITCHABLE ROUTING - A simplified explanation of the abstract

This abstract first appeared for US patent application 18486950 titled 'SEMICONDUCTOR DEVICES WITH REDISTRIBUTION STRUCTURES CONFIGURED FOR SWITCHABLE ROUTING

Simplified Explanation

• • Explanation:**

The patent application describes semiconductor devices with redistribution structures that allow for signal routing between semiconductor dies to be altered based on the location of an interconnect structure.

• • Key Points:**
• Semiconductor package includes two semiconductor dies with redistribution structures aligned with each other.
• Interconnect structure electrically couples the redistribution structures of the two semiconductor dies.
• Signal routing between the semiconductor dies can be altered based on the location of the interconnect structure.

• • Potential Applications:**
• Integrated circuits
• Microprocessors
• Memory devices

• • Problems Solved:**
• Improved signal routing between semiconductor dies
• Enhanced electrical coupling between semiconductor components

• • Benefits:**
• Increased efficiency in signal routing
• Enhanced performance of semiconductor devices
• Improved reliability of semiconductor packages

Original Abstract Submitted

Semiconductor devices having redistribution structures, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor package includes a first semiconductor die including a first redistribution structure and a second semiconductor die including a second redistribution structure. The first and second semiconductor dies can be mounted on a package substrate such that the first and second redistribution structures are aligned with each other. In some embodiments, an interconnect structure can be positioned between the first and second semiconductor dies to electrically couple the first and second redistribution structures to each other. The first and second redistribution structures can be configured such that signal routing between the first and second semiconductor dies can be altered based on the location of the interconnect structure.