18486752. MM-WAVE RESONANT TERMINATION LOAD EMBEDDED IN A PCB SUBSTRATE AND ANTENNA ARRAY INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

MM-WAVE RESONANT TERMINATION LOAD EMBEDDED IN A PCB SUBSTRATE AND ANTENNA ARRAY INCLUDING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Gennadiy Aleksandrovich Evtyushkin of Moscow (RU)

Elena Aleksandrovna Shepeleva of Moscow (RU)

Anton Sergeevich Lukyanov of Moscow (RU)

MM-WAVE RESONANT TERMINATION LOAD EMBEDDED IN A PCB SUBSTRATE AND ANTENNA ARRAY INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18486752 titled 'MM-WAVE RESONANT TERMINATION LOAD EMBEDDED IN A PCB SUBSTRATE AND ANTENNA ARRAY INCLUDING THE SAME

Simplified Explanation

The disclosure is about a termination load embedded in a printed circuit board substrate and an antenna array including the termination load. The termination load reduces complexity and size, increases reliability, and improves wireless data transmission speed in antenna arrays.

• The termination load embedded in the printed circuit board substrate includes a feeding line fragment, a transitional patch, a top resonator patch, a top metal ground layer, and a resistive material in a gap between the top resonator patch and the top metal layer.
• The feeding line terminates in the termination load with an excitation probe, located between the bottom ground layer and the top layer of the printed circuit board.
• The transitional patch, excitation probe, and top resonator patch are coupled by electromagnetic coupling.

Potential Applications

This technology can be applied in:

• Wireless communication systems
• Antenna arrays for data transmission

Problems Solved

• Reduced complexity and size of termination loads
• Increased reliability and speed of wireless data transmission

Benefits

• Improved reliability in antenna arrays
• Enhanced data transmission speed
• Simplified design and construction of termination loads

Potential Commercial Applications

• Telecommunications industry
• IoT devices
• Satellite communication systems

Possible Prior Art

One possible prior art could be the use of traditional termination loads in antenna arrays without the embedded design for improved reliability and speed.

Unanswered Questions

1. How does the electromagnetic coupling between the components affect the overall performance of the termination load? 2. Are there any specific limitations or constraints in implementing this technology in different types of antenna arrays?

Original Abstract Submitted

The disclosure relates to radio engineering, for example to a termination load embedded in a printed circuit board substrate and an antenna array including the termination load. The disclosure reduces the complexity and size and increases the reliability of the termination load, as well as in increasing the reliability and speed of wireless data transmission in antenna arrays that use the termination loads. The termination load embedded in the printed circuit board substrate comprises: a fragment of at least one feeding line, a transitional patch, a top resonator patch, a top metal ground layer coplanar with the top patch, wherein a resistive material is disposed in a gap between the top resonator patch and the top metal layer, said fragment of the at least one feeding line terminates in the termination load in the form of an excitation probe, said at least one feeding line is located in the printed circuit board between the bottom ground layer of the printed circuit board and the top layer of the printed circuit board, in which the top resonator patch, the resistive material and the top metal layer are located, the transitional patch is located in the printed circuit board between the layer in which at least one feeding line is located and said top layer, the excitation probe, the transitional patch and the top resonator patch are coupled to each other by electromagnetic coupling.