18483444. LIGHT EMITTING ELEMENT, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE INCLUDING THE LIGHT EMITTING ELEMENT simplified abstract (SAMSUNG DISPLAY CO., LTD.)

LIGHT EMITTING ELEMENT, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE INCLUDING THE LIGHT EMITTING ELEMENT

Organization Name

SAMSUNG DISPLAY CO., LTD.

Inventor(s)

Hyun Min Cho of Seoul (KR)

Dae Hyun Kim of Hwaseong-si (KR)

Dong Uk Kim of Hwaseong-si (KR)

Jung Hong Min of Pyeongtaek-si (KR)

Seung A Lee of Seoul (KR)

Hyung Rae Cha of Seoul (KR)

LIGHT EMITTING ELEMENT, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE INCLUDING THE LIGHT EMITTING ELEMENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18483444 titled 'LIGHT EMITTING ELEMENT, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE INCLUDING THE LIGHT EMITTING ELEMENT

Simplified Explanation

The abstract describes a patent application for a light emitting device and a method for manufacturing the device. The device includes a lower substrate with a buffer semiconductor layer, an element rod formed on the lower substrate, and semiconductor layers and insulating layers surrounding the element rod. The method involves preparing the lower substrate, forming the element rod and semiconductor layers on the separating layer, and etching the layers to form the light emitting element.

• The patent application describes a light emitting device and a method for manufacturing the device.
• The device includes a lower substrate with a buffer semiconductor layer.
• An element rod is formed on the lower substrate using a separating layer.
• The element rod consists of a first conductivity type semiconductor layer, an active material layer, and a second conductivity type semiconductor layer.
• The layers are etched in a perpendicular direction to the lower substrate.
• A first insulating layer is formed around the outer circumferential surface of the element rod.
• A second insulating layer is formed around the outer circumferential surface of the first insulating layer, separating the element rod from the lower substrate.
• The result is a light emitting element.

Potential Applications

• This technology can be used in various display devices, such as televisions, smartphones, and computer monitors.
• It can also be applied in lighting systems, such as LED lamps and backlighting for displays.
• The light emitting device can be used in automotive lighting, signage, and other applications requiring efficient and durable light sources.

Problems Solved

• The method for manufacturing the light emitting device provides a simplified and efficient process.
• The use of the separating layer allows for precise formation of the element rod and semiconductor layers.
• The insulating layers provide electrical isolation and protection for the light emitting element.
• The technology solves the problem of achieving high-quality light emission in a compact and reliable device.

Benefits

• The light emitting device manufactured using this method offers improved performance and reliability.
• The device can produce high-quality light with enhanced color accuracy and brightness.
• The manufacturing process is cost-effective and scalable for mass production.
• The technology enables the development of thinner and more energy-efficient display devices.
• The light emitting element has a longer lifespan compared to traditional light sources.

Original Abstract Submitted

Provided are a light emitting device, a method for manufacturing same, and a display device including the light emitting device. The method for manufacturing the light emitting device comprises the steps of: preparing a lower substrate including a substrate and a buffer semiconductor layer formed on the substrate, forming an element rod by forming a separating layer disposed on the lower substrate, forming a first conductivity type semiconductor layer, an active material layer, and a second conductivity type semiconductor layer on the separating layer, and etching the first conductivity type semiconductor layer, the active material layer, the second conductivity type semiconductor layer, and the separating layer in a direction perpendicular to the lower substrate, forming a first insulating layer surrounding an outer circumferential surface of the element rod, forming a second insulating layer surrounding an outer circumferential surface of the first insulating layer and separating the element rod from the lower substrate to form a light emitting element.