18480148. OVERLAY MARK, MANUFACTURING METHOD USING THE SAME, AND SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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OVERLAY MARK, MANUFACTURING METHOD USING THE SAME, AND SEMICONDUCTOR DEVICE USING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Sang Won Park of Suwon-si (KR)

A Yeong Cha of Suwon-si (KR)

Byeong-Hwan Son of Suwon-si (KR)

Hye Jin Lee of Suwon-si (KR)

Jung Hyun Choi of Suwon-si (KR)

Jong Hee Han of Suwon-si (KR)

OVERLAY MARK, MANUFACTURING METHOD USING THE SAME, AND SEMICONDUCTOR DEVICE USING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18480148 titled 'OVERLAY MARK, MANUFACTURING METHOD USING THE SAME, AND SEMICONDUCTOR DEVICE USING THE SAME

Simplified Explanation

The overlay mark in this patent application consists of a substrate, a lower overlay, a pattern layer, and an upper overlay with an opening on the pattern layer. The lower overlay does not overlap the upper overlay in the thickness direction of the substrate.

  • Substrate
  • Lower overlay
  • Pattern layer
  • Upper overlay with opening
  • Non-overlapping lower and upper overlays

Potential Applications

The technology described in this patent application could potentially be used in:

  • Anti-counterfeiting measures
  • Security features for documents or products
  • Decorative or design elements in various industries

Problems Solved

This technology helps address the following issues:

  • Counterfeiting and fraud prevention
  • Enhancing the security of sensitive documents or products
  • Adding unique and visually appealing features to items

Benefits

The benefits of this technology include:

  • Improved security measures
  • Customizable design options
  • Enhanced visual appeal

Potential Commercial Applications

With its security and design capabilities, this technology could find applications in:

  • Currency and banknotes
  • Official documents like passports and IDs
  • High-end product packaging

Possible Prior Art

One possible prior art for this technology could be holographic overlays used in security features for documents or products.

Unanswered Questions

How does this technology compare to existing security features in terms of cost-effectiveness?

This article does not provide information on the cost implications of implementing this technology compared to other security features.

What are the environmental impacts of producing and disposing of products with this technology?

The environmental considerations related to the production and disposal of items incorporating this technology are not addressed in this article.


Original Abstract Submitted

Provided is an overlay mark. The overlay mark comprises a substrate, a lower overlay in the substrate, a pattern layer on the substrate, and an upper overlay defining an opening on the pattern layer. The lower overlay does not overlap the upper overlay in a thickness direction of the substrate.