18479734. LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS simplified abstract (SEIKO EPSON CORPORATION)
Contents
- 1 LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS
Organization Name
Inventor(s)
Fumiya Takino of SHIOJIRI-SHI (JP)
LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18479734 titled 'LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS
Simplified Explanation
The abstract describes a patent application for a head chip with nozzles to eject liquid, an adhesive to bond the chip to another member, and a heating element to melt the adhesive.
- Head chip with nozzles for liquid ejection
- Adhesive for bonding head chip to another member
- Heating element to melt adhesive for bonding
Potential Applications
The technology could be used in inkjet printers, 3D printers, or other devices that require precise liquid ejection.
Problems Solved
This technology solves the problem of securely bonding a head chip with nozzles to another member in a reliable and efficient manner.
Benefits
The benefits of this technology include improved performance and reliability of devices that require liquid ejection, as well as simplified manufacturing processes.
Potential Commercial Applications
The technology could be applied in the manufacturing of inkjet printers, 3D printers, medical devices, and other equipment that require precise liquid ejection capabilities.
Possible Prior Art
Prior art may include existing methods of bonding components in electronic devices or printers, as well as technologies related to liquid ejection systems.
Unanswered Questions
How does the heating element affect the overall efficiency of the bonding process?
The heating element is crucial for melting the adhesive, but its impact on the overall efficiency of the bonding process is not explicitly discussed in the abstract.
Are there any specific types of adhesives recommended for use with this technology?
The abstract mentions the use of an adhesive to bond the head chip and another member, but it does not specify any particular types of adhesives that are best suited for this application.
Original Abstract Submitted
A head chip that includes a nozzle plate having a plurality of nozzles configure to eject a liquid, another member different from the head chip, an adhesive that bonds the head chip and the other member, and a heating element configured to plasticize the adhesive are provided.
