18479222. METHOD OF MANUFACTURING LIQUID EJECTING HEAD simplified abstract (SEIKO EPSON CORPORATION)
Contents
- 1 METHOD OF MANUFACTURING LIQUID EJECTING HEAD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHOD OF MANUFACTURING LIQUID EJECTING HEAD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
METHOD OF MANUFACTURING LIQUID EJECTING HEAD
Organization Name
Inventor(s)
Fumiya Takino of SHIOJIRI-SHI (JP)
METHOD OF MANUFACTURING LIQUID EJECTING HEAD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18479222 titled 'METHOD OF MANUFACTURING LIQUID EJECTING HEAD
Simplified Explanation
The method described in the patent application involves manufacturing a liquid ejecting head by heating an adhesive to bond and cure components together, disassembling the components after heating to release the bond, and then replacing at least one component with a new product.
- Heating step: The adhesive is heated to plasticize and bond the first and second components together.
- Disassembling step: The bond between the components is released by heating, allowing for easy disassembly.
- Replacing step: After disassembly, at least one component is replaced with a new product.
Potential Applications
The technology could be applied in the manufacturing of various liquid ejecting heads, such as in inkjet printers, 3D printers, and industrial printing systems.
Problems Solved
This method allows for easy disassembly and replacement of components in liquid ejecting heads, reducing the need for complex and time-consuming repair processes.
Benefits
- Simplified maintenance and repair processes - Cost-effective component replacement - Improved overall performance and longevity of liquid ejecting heads
Potential Commercial Applications
"Efficient Component Replacement in Liquid Ejecting Heads: Applications and Benefits"
Possible Prior Art
There may be prior art related to methods of bonding and disassembling components in various electronic devices, but specific examples are not provided in the abstract.
Unanswered Questions
How does this method compare to traditional methods of manufacturing liquid ejecting heads?
This method seems to offer a more efficient way of replacing components, but it would be interesting to know if it affects the overall performance or durability of the liquid ejecting head.
Are there any specific industries or sectors that would benefit most from this technology?
It would be helpful to understand if certain industries, such as large-scale printing or manufacturing, would see the most significant advantages from implementing this method.
Original Abstract Submitted
A method of manufacturing a liquid ejecting head including a first component and a second component, the method includes a heating step of heating an adhesive that bonds and cures the first component and the second component to plasticize the adhesive, a disassembling step of releasing a bonding state between the first component and the second component by the heating step, and a replacing step of replacing at least one of the first component and the second component with a new product after the disassembling step.
