18477060. FILM FORMING APPARATUS AND FILM FORMING METHOD simplified abstract (Tokyo Electron Limited)
Contents
- 1 FILM FORMING APPARATUS AND FILM FORMING METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 FILM FORMING APPARATUS AND FILM FORMING METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
FILM FORMING APPARATUS AND FILM FORMING METHOD
Organization Name
Inventor(s)
Yasunobu Suzuki of Yamanashi (JP)
FILM FORMING APPARATUS AND FILM FORMING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18477060 titled 'FILM FORMING APPARATUS AND FILM FORMING METHOD
Simplified Explanation
The film forming apparatus described in the patent application includes a processing chamber, a stage for holding the substrate, a film forming part, a movable shutter, and a film thickness measuring part.
- The processing chamber is where the film formation takes place.
- The stage holds the substrate during the film formation process.
- The film forming part is responsible for applying the film onto the substrate.
- The movable shutter can shield the substrate on the stage or retract to allow the film forming part to work on the substrate.
- The film thickness measuring part includes a device to measure the thickness of the film formed on the shutter.
Potential Applications
The technology described in this patent application could be used in industries such as semiconductor manufacturing, display technology, and optical coatings.
Problems Solved
This technology solves the problem of accurately measuring the film thickness during the film formation process, which is crucial for ensuring the quality and performance of the final product.
Benefits
The benefits of this technology include improved control over the film formation process, enhanced product quality, and increased efficiency in manufacturing operations.
Potential Commercial Applications
One potential commercial application of this technology could be in the production of high-quality optical coatings for lenses and mirrors used in various industries.
Possible Prior Art
One possible prior art for this technology could be similar film forming apparatus used in semiconductor manufacturing or thin film deposition processes.
Unanswered Questions
How does the film thickness measuring device communicate the measurement data?
The patent application does not specify how the film thickness measuring device transmits the measurement data for analysis and control purposes.
What materials are suitable for the film forming part in this apparatus?
The patent application does not mention the specific materials that can be used for the film forming part, which could impact the performance and durability of the apparatus.
Original Abstract Submitted
A film forming apparatus for performing film formation on a substrate comprises a processing chamber, a stage configured to place thereon a substrate disposed in the processing chamber, a film forming part configured to perform film formation on the substrate placed on the stage, a shutter that is movable between a shielding position where the substrate on the stage is shielded and a retracted position retracted from the stage and where the film forming part performs the film formation on the substrate, and a film thickness measuring part. The film thickness measuring part has a film thickness measuring device configured to measure a film thickness of a film formed on the shutter at the shielding position by the film forming part.
