18477024. ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Hyunje Cho of Suwon-si (KR)

Jiwoo Lee of Suwon-si (KR)

ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18477024 titled 'ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE

Simplified Explanation

According to an embodiment, the abstract describes an electronic device that includes a housing with an opening, a cover for opening and closing the opening, and a link structure located inside the housing and connected to the cover. The link structure includes an actuator that outputs power based on the temperature sensed inside the housing. It also includes a first link that moves in a first direction using the power from the actuator, a second link with a resilient structure that transmits the power in a second direction perpendicular to the first direction, and a third link connected to the second link and the cover. The third link converts the cover from a closed state to an open state by transmitting the power in the first direction and a third direction perpendicular to the second direction.

  • The electronic device has a housing with an opening and a cover that can be opened and closed.
  • Inside the housing, there is a link structure connected to the cover.
  • The link structure includes an actuator that generates power based on the temperature inside the housing.
  • A first link in the link structure moves in a first direction using the power from the actuator.
  • A second link in the link structure has a resilient structure that transmits the power in a second direction perpendicular to the first direction.
  • The second link includes two springs with different elastic forces.
  • A third link is connected to the second link and the cover.
  • The third link converts the cover from a closed state to an open state by transmitting the power in the first direction and a third direction perpendicular to the second direction.

Potential applications of this technology:

  • This technology can be used in electronic devices such as smartphones, tablets, or laptops to provide automated opening and closing of the device's cover.
  • It can also be applied in smart home devices, such as smart curtains or blinds, to automate their opening and closing based on temperature or other environmental factors.

Problems solved by this technology:

  • This technology eliminates the need for manual opening and closing of device covers, providing convenience and ease of use.
  • It allows for automated control of device covers based on internal temperature, improving thermal management and potentially extending the lifespan of electronic components.

Benefits of this technology:

  • Automated opening and closing of device covers enhance user experience and convenience.
  • The ability to control the cover based on internal temperature helps in maintaining optimal operating conditions for electronic devices.
  • The use of different springs in the link structure allows for precise and controlled movement of the cover.


Original Abstract Submitted

According to an embodiment, an electronic device comprises: a housing comprising an opening; a cover for opening and closing the opening; and a link structure located inside the housing and connected to the cover, wherein the link structure may comprise: an actuator configured to output power based on the temperature sensed inside the housing; a first link configured to move in a first direction by means of the power; a second link having a resilient structure that, in response to the movement of the first link, is configured to transmit the power in a second direction perpendicular to the first direction and comprises a first spring and a second spring having different elastic forces; and a third link connected to the second link and the cover and configured to convert the cover from a closed state to an open state by transmitting the power in the first direction and a third direction perpendicular to the second direction.