18476736. Liquid Discharge Apparatus And Liquid Discharge Module simplified abstract (SEIKO EPSON CORPORATION)
Contents
- 1 Liquid Discharge Apparatus And Liquid Discharge Module
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Liquid Discharge Apparatus And Liquid Discharge Module - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
Liquid Discharge Apparatus And Liquid Discharge Module
Organization Name
Inventor(s)
Masahiko Tsuyuki of Chino (JP)
Makoto Takamuku of Matsumoto (JP)
Liquid Discharge Apparatus And Liquid Discharge Module - A simplified explanation of the abstract
This abstract first appeared for US patent application 18476736 titled 'Liquid Discharge Apparatus And Liquid Discharge Module
Simplified Explanation
The liquid discharge apparatus described in the patent application includes a first substrate with a first electronic component, a second substrate with a second electronic component, a cooling fan, heat sinks attached to each substrate, and a gas flow path created by the substrates.
- The apparatus consists of a first substrate with a first electronic component and a second substrate with a second electronic component.
- A cooling fan generates an air flow in a gas flow path created by the front surfaces of the substrates.
- Heat sinks are attached to each substrate to dissipate heat generated by the electronic components.
Potential Applications
The technology described in this patent application could be applied in various liquid discharge systems, such as inkjet printers, 3D printers, and industrial printing machines.
Problems Solved
This technology solves the problem of overheating electronic components in liquid discharge systems, which can lead to reduced performance and potential damage to the equipment.
Benefits
The use of heat sinks and a cooling fan helps to maintain optimal operating temperatures for the electronic components, ensuring consistent and reliable performance of the liquid discharge apparatus.
Potential Commercial Applications
This technology could be utilized in the manufacturing of high-performance liquid discharge systems for commercial printing, industrial applications, and consumer electronics.
Possible Prior Art
One possible prior art for this technology could be similar cooling systems used in electronic devices and industrial machinery to prevent overheating of components.
Unanswered Questions
How does this technology compare to existing liquid discharge apparatus cooling systems in terms of efficiency and effectiveness?
This article does not provide a direct comparison with existing cooling systems in liquid discharge apparatus, leaving the reader to wonder about the advantages and disadvantages of this new technology.
What are the potential cost implications of implementing this cooling system in liquid discharge apparatus?
The article does not address the cost considerations associated with integrating this cooling system into liquid discharge apparatus, leaving readers curious about the economic feasibility of adopting this technology.
Original Abstract Submitted
There is provide a liquid discharge apparatus including: a first substrate including a first substrate front surface and a first substrate back surface opposite to the first substrate front surface; a second substrate including a second substrate front surface and a second substrate back surface opposite to the second substrate front surface; a first circuit having a first electronic component provided on the first substrate front surface; a second circuit having a second electronic component provided on the second substrate front surface; a cooling fan that generates an air flow in a gas flow path configured by the first substrate front surface and the second substrate front surface; a first heat sink attached to the first substrate; and a second heat sink attached to the second substrate.
