18476529. Vibrator Element simplified abstract (SEIKO EPSON CORPORATION)

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Vibrator Element

Organization Name

SEIKO EPSON CORPORATION

Inventor(s)

Osamu Kawauchi of Shiojiri (JP)

Vibrator Element - A simplified explanation of the abstract

This abstract first appeared for US patent application 18476529 titled 'Vibrator Element

Simplified Explanation

The abstract describes a vibrator element with a plate-shaped vibrating substrate, electrode layers, and metal films for excitation and coupling purposes.

  • Plate-shaped vibrating substrate with vibrating, support, and coupling portions
  • Electrode layer with excitation electrodes, pad electrodes, and coupling electrodes
  • First metal film on the first coupling electrode
  • Second metal film on the second coupling electrode

Potential Applications

This technology could be used in various vibrating devices such as vibrators, haptic feedback devices, and sensors.

Problems Solved

This technology provides a more efficient and precise way of generating vibrations in devices compared to traditional methods.

Benefits

The benefits of this technology include improved vibration control, increased durability, and enhanced performance in vibrating devices.

Potential Commercial Applications

  • "Innovative Vibrator Element Technology for Enhanced Vibration Control"

Possible Prior Art

There may be prior art related to vibrating elements and electrode layers in vibrating devices.

Unanswered Questions

How does this technology compare to existing vibrating element designs in terms of efficiency and performance?

This article does not provide a direct comparison with existing vibrating element designs to assess its efficiency and performance.

What are the potential limitations or challenges in implementing this technology in commercial products?

The article does not address any potential limitations or challenges that may arise in the commercial implementation of this technology.


Original Abstract Submitted

A vibrator element includes: a plate-shaped vibrating substrate including a first surface and a second surface, which are in a front and back relationship, and including a vibrating portion, a support portion, and a coupling portion that couples the vibrating portion to the support portion and includes a portion having a thickness smaller than that of the support portion; an electrode layer including a first excitation electrode disposed at the first surface at the vibrating portion, a second excitation electrode disposed at the second surface at the vibrating portion, a first pad electrode disposed at the support portion, a second pad electrode disposed at the support portion, a first coupling electrode disposed at the coupling portion and coupling the first excitation electrode to the first pad electrode, and a second coupling electrode disposed at the coupling portion and coupling the second excitation electrode to the second pad electrode; a first metal film disposed at an upper layer on the first coupling electrode that is located on the coupling portion and having a thickness larger than that of the electrode layer; and a second metal film disposed at an upper layer on the second coupling electrode that is located on the coupling portion and having a thickness larger than that of the electrode layer.