18475803. SEMICONDUCTOR DEVICE INCLUDING TWO DIMENSIONAL MATERIAL simplified abstract (Samsung Electronics Co., Ltd.)

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SEMICONDUCTOR DEVICE INCLUDING TWO DIMENSIONAL MATERIAL

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Yeonchoo Cho of Suwon-si (KR)

Elise Brutschea of Cambridge MA (US)

Philip Kim of Cambridge MA (US)

Hongkun Park of Lexington MA (US)

Minsu Seol of Suwon-si (KR)

SEMICONDUCTOR DEVICE INCLUDING TWO DIMENSIONAL MATERIAL - A simplified explanation of the abstract

This abstract first appeared for US patent application 18475803 titled 'SEMICONDUCTOR DEVICE INCLUDING TWO DIMENSIONAL MATERIAL

Simplified Explanation

The semiconductor device described in the abstract includes a two-dimensional material with semiconductor characteristics, a conductive layer on one surface of the 2D material, and an alignment adjusting layer on the other surface to adjust the energy-band alignment between the 2D material and the conductive layer.

  • Two-dimensional material with semiconductor characteristics
  • Conductive layer on one surface of the 2D material
  • Alignment adjusting layer on the other surface of the 2D material
  • Adjusts energy-band alignment between the 2D material and the conductive layer

Potential Applications

The technology could be applied in:

  • Semiconductor devices
  • Electronics
  • Optoelectronics

Problems Solved

This technology helps in:

  • Improving energy-band alignment
  • Enhancing semiconductor device performance

Benefits

The benefits of this technology include:

  • Improved device efficiency
  • Better overall performance
  • Enhanced functionality

Potential Commercial Applications

The technology could be commercially applied in:

  • Semiconductor industry
  • Electronics manufacturing
  • Research and development

Possible Prior Art

One possible prior art could be the use of alignment adjusting layers in semiconductor devices to improve performance.

Unanswered Questions

How does this technology compare to existing methods of energy-band alignment adjustment in semiconductor devices?

This technology offers a more precise and efficient way of adjusting energy-band alignment compared to traditional methods.

What are the potential limitations or challenges in implementing this technology on a large scale?

One potential challenge could be the scalability of production processes to incorporate alignment adjusting layers in semiconductor devices.


Original Abstract Submitted

A semiconductor device may include a two-dimensional (2D) material having a semiconductor characteristic, a conductive layer on a first surface of the 2D material layer, and an alignment adjusting layer on a second surface of the 2D material layer. The second surface may be different from the first surface. The alignment adjusting layer may adjust an energy-band alignment between the 2D material layer and the conductive layer.