18475151. COIL COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)

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COIL COMPONENT

Organization Name

Murata Manufacturing Co., Ltd.

Inventor(s)

Takuma Sagara of Nagaokakyo-shi (JP)

Katsuyuki Takahashi of Nagaokakyo-shi (JP)

Shingo Nakamoto of Nagaokakyo-shi (JP)

COIL COMPONENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18475151 titled 'COIL COMPONENT

Simplified Explanation

The patent application describes a coil component designed to prevent a decrease in mounting strength. The component includes a drum core with flange portions and a metal terminal with bonding, connecting, and mounting portions. The terminal is bonded to the flange portion with an adhesive, and the mounting portion is closest to the positive direction side and separated from the flange portion. The flange portion has a facing surface, bonding surface, and an inclined surface between them.

  • Coil component designed to prevent a decrease in mounting strength
  • Metal terminal with bonding, connecting, and mounting portions
  • Terminal bonded to flange portion with adhesive
  • Mounting portion closest to positive direction side
  • Flange portion with facing, bonding, and inclined surfaces

Potential Applications

The technology can be applied in various electronic devices and equipment that require coil components with high mounting strength.

Problems Solved

The innovation addresses the issue of a decrease in mounting strength of coil components, ensuring reliability and stability in electronic devices.

Benefits

- Improved mounting strength of coil components - Enhanced reliability and stability in electronic devices - Prevents potential failures due to weak mounting

Potential Commercial Applications

The technology can be utilized in the manufacturing of electronic devices such as smartphones, computers, automotive systems, and industrial equipment.

Possible Prior Art

Prior art may include patents or publications related to coil components, mounting techniques, or adhesive bonding in electronic devices.

Unanswered Questions

How does this technology compare to existing coil component designs in terms of mounting strength and reliability?

The article does not provide a direct comparison with existing coil component designs, making it unclear how this innovation stands out in terms of performance and effectiveness.

What specific electronic devices or industries can benefit the most from this improved coil component design?

The article does not specify which electronic devices or industries would benefit the most from this technology, leaving room for further exploration into potential target markets.


Original Abstract Submitted

To suppress a decrease in mounting strength of a coil component, a coil component includes a drum core including a winding core portion, and first and second flange portions. The coil component includes a first metal terminal which includes a bonding portion, a connecting portion, and a mounting portion. The bonding portion is bonded to the first flange portion with an adhesive. The mounting portion is closest to the first positive direction side in the first metal terminal and is separated from the first flange portion toward the first positive direction side. The connecting portion connects the bonding and mounting portions. The first flange portion has a facing surface that faces the mounting portion, a bonding surface, and a first inclined surface between the facing and bonding surfaces. The distance from the facing surface increases in a direction parallel to the first axis toward the bonding surface.