18471730. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Jeong Hyuk Yim of Suwon-si (KR)
Hyo Seok Choi of Suwon-si (KR)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18471730 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor device described in the abstract includes a first film and a second film defining parts of a trench, a plug conductive film, a via, and wiring in the trench. The plug conductive film extends from one side of the first film to penetrate the bottom face of the trench, with its uppermost face in the trench. An insulating liner is present between the plug conductive film and the first film, and the upper face of the insulating liner is exposed by the bottom face of a second sub-trench. The uppermost face of the plug conductive film and at least a part of a side wall of the plug conductive film are in contact with the wiring.
- The semiconductor device includes:
* First film and second film defining parts of a trench * Plug conductive film extending from one side of the first film to penetrate the bottom face of the trench * Via with an insulating liner between the plug conductive film and the first film * Wiring in the trench * Second sub-trench with a smaller width than the first sub-trench
Potential Applications
The technology described in this patent application could be applied in the manufacturing of advanced semiconductor devices, such as integrated circuits, memory chips, and microprocessors.
Problems Solved
This technology helps in improving the efficiency and performance of semiconductor devices by providing a more compact and reliable structure for connecting different components within the device.
Benefits
- Enhanced performance and reliability of semiconductor devices
- More compact design for better integration of components
- Improved manufacturing processes for semiconductor devices
Potential Commercial Applications
- Semiconductor industry for manufacturing advanced electronic devices
- Technology companies for developing cutting-edge products requiring high-performance semiconductor components
Possible Prior Art
One possible prior art for this technology could be the use of similar trench structures and plug conductive films in semiconductor devices, but with variations in the design and manufacturing process.
Unanswered Questions
How does this technology impact the overall cost of manufacturing semiconductor devices?
The abstract does not provide information on the cost implications of implementing this technology in semiconductor device manufacturing.
What specific performance improvements can be expected from the use of this technology?
The abstract does not detail the specific performance enhancements that can be achieved by incorporating this technology in semiconductor devices.
Original Abstract Submitted
A semiconductor device may include a first film and a second film defining parts of a trench, a plug conductive film, a via, and a wiring in the trench. The trench may include a second sub-trench having a second width below a first sub-trench having a first width. The plug conductive film may extend from a first side of the first film to penetrate a bottom face of the trench. An uppermost face of the plug conducive film may be in the trench. The via may include an insulating liner between the plug conductive film and the first film. The uppermost face of the plug conductive film and at least a part of a side wall of the plug conductive film may be in contact with the wiring. An upper face of the insulating liner may be exposed by a bottom face of the second sub-trench.
