18471005. METHOD FOR INTEGRATION OF OPTICAL DEVICE FABRICATION WITH SUBSTRATE THICKNESS ENGINEERING simplified abstract (Applied Materials, Inc.)
Contents
- 1 METHOD FOR INTEGRATION OF OPTICAL DEVICE FABRICATION WITH SUBSTRATE THICKNESS ENGINEERING
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHOD FOR INTEGRATION OF OPTICAL DEVICE FABRICATION WITH SUBSTRATE THICKNESS ENGINEERING - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
METHOD FOR INTEGRATION OF OPTICAL DEVICE FABRICATION WITH SUBSTRATE THICKNESS ENGINEERING
Organization Name
Inventor(s)
Andrew Ceballos of Palo Alto CA (US)
METHOD FOR INTEGRATION OF OPTICAL DEVICE FABRICATION WITH SUBSTRATE THICKNESS ENGINEERING - A simplified explanation of the abstract
This abstract first appeared for US patent application 18471005 titled 'METHOD FOR INTEGRATION OF OPTICAL DEVICE FABRICATION WITH SUBSTRATE THICKNESS ENGINEERING
Simplified Explanation
Embodiments of the present disclosure involve introducing an encapsulation material into an optical device with a consistent thickness distribution at one or more eyepiece areas across a substrate. This target thickness distribution reduces variation in substrate thickness from substrate to substrate. The use of maskless patterning techniques like gray-tone lithography and inkjet printing eliminates the need for additional processing steps to achieve the desired thickness distribution. The encapsulation material between the optical device layer and the index-matched layer serves to protect the index-matched layer from damage.
- Consistent thickness distribution in eyepiece areas reduces substrate thickness variation
- Maskless patterning techniques like gray-tone lithography and inkjet printing eliminate additional processing steps
- Encapsulation material protects index-matched layer from damage
Potential Applications
This technology could be applied in the manufacturing of optical devices such as lenses, cameras, and microscopes.
Problems Solved
This technology solves the issue of substrate thickness variation in optical devices, ensuring consistent performance and quality.
Benefits
The benefits of this technology include improved optical device performance, reduced manufacturing complexity, and enhanced durability.
Potential Commercial Applications
Potential commercial applications of this technology include the production of high-quality lenses for cameras, microscopes, and other optical instruments.
Possible Prior Art
One possible prior art could be the use of traditional lithography techniques for patterning substrates in optical devices.
Unanswered Questions
How does this technology compare to traditional methods of achieving consistent thickness distribution in optical devices?
This technology offers a more efficient and cost-effective solution compared to traditional methods that may involve multiple processing steps.
What impact could this technology have on the overall quality and performance of optical devices?
By ensuring a consistent thickness distribution, this technology could significantly improve the quality and performance of optical devices, leading to better imaging and overall user experience.
Original Abstract Submitted
Embodiments of the present disclosure generally relate to the introduction of an encapsulation material into an optical device formed with a same thickness distribution at one or more eyepiece areas across a substrate. The target thickness distribution formed in at least each eyepiece area reduces variation of substrate thickness from substrate to substrate. Forming the target thickness distribution in the substrate and the index-matched layer with maskless patterning such as gray-tone lithography and inkjet printing eliminates subsequent processing steps to achieve the target thickness distribution. An encapsulation material between the optical device layer and the index-matched layer will protect the index-matched layer from damage.
