18469673. ETCHING CONTROL DEVICE, ETCHING CONTROL METHOD, AND ETCHING CONTROL SYSTEM simplified abstract (TOKYO ELECTRON LIMITED)
Contents
- 1 ETCHING CONTROL DEVICE, ETCHING CONTROL METHOD, AND ETCHING CONTROL SYSTEM
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ETCHING CONTROL DEVICE, ETCHING CONTROL METHOD, AND ETCHING CONTROL SYSTEM - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
ETCHING CONTROL DEVICE, ETCHING CONTROL METHOD, AND ETCHING CONTROL SYSTEM
Organization Name
Inventor(s)
Toyohisa Tsuruda of Koshi City (JP)
Hiroshi Marumoto of Koshi City (JP)
Masashi Enomoto of Koshi City (JP)
ETCHING CONTROL DEVICE, ETCHING CONTROL METHOD, AND ETCHING CONTROL SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18469673 titled 'ETCHING CONTROL DEVICE, ETCHING CONTROL METHOD, AND ETCHING CONTROL SYSTEM
Simplified Explanation
The abstract describes an etching control device that optimizes a model representing the relationship between the distribution of etching amount on a substrate surface and a process parameter controlling multiple nozzles for etching. The device includes an updating unit, a calculator, and an operation controller.
- The updating unit optimizes the model by updating the parameter representing the relationship between etching amount distribution and process parameters.
- The calculator determines the process parameter corresponding to a designated etching amount distribution using the updated model.
- The operation controller controls the operations of multiple nozzles based on the calculated process parameter.
Potential Applications
This technology can be applied in semiconductor manufacturing, printed circuit board production, and other industries where precise etching control is required.
Problems Solved
This technology solves the problem of inefficient etching processes, inaccurate etching amount distribution, and lack of control over multiple nozzles in etching operations.
Benefits
The benefits of this technology include improved etching precision, increased efficiency in manufacturing processes, and enhanced control over etching operations.
Potential Commercial Applications
Potential commercial applications of this technology include semiconductor fabrication facilities, electronics manufacturing companies, and research institutions focusing on nanotechnology.
Possible Prior Art
One possible prior art could be the use of traditional etching control devices that do not optimize models based on updated parameters, resulting in less precise etching processes.
What is the specific model used to indicate the relationship between etching amount distribution and process parameters in this technology?
The specific model used in this technology is optimized to accurately represent the relationship between the distribution of etching amount within a substrate surface and the process parameters controlling the operations of multiple nozzles for etching.
How does the updating unit optimize the model in this technology?
The updating unit optimizes the model by updating the parameter representing the relationship between etching amount distribution and process parameters, ensuring that the model reflects the most current and accurate data for precise etching control.
Original Abstract Submitted
An etching control device includes an updating unit configured to update, to optimize a model indicating a relationship between distribution of an etching amount within a surface of a substrate and a process parameter, which is a parameter of controlling operations of multiple nozzles configured to etch the substrate, a parameter of the model; a calculator configured to calculate the process parameter corresponding to distribution of a designated etching amount by using the model whose parameter has been updated by the updating unit; and an operation controller configured to control the operations of the multiple nozzles by using the process parameter.
