18469619. SUBSTRATE TREATMENT APPARATUS AND METHOD FOR TREATING SUBSTRATE simplified abstract (Kioxia Corporation)
Contents
- 1 SUBSTRATE TREATMENT APPARATUS AND METHOD FOR TREATING SUBSTRATE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE TREATMENT APPARATUS AND METHOD FOR TREATING SUBSTRATE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does the apparatus ensure that the liquid supply is sufficient to remove all contaminants from the substrate surface?
- 1.11 What is the expected lifespan of the components of the apparatus, and how often would maintenance be required?
- 1.12 Original Abstract Submitted
SUBSTRATE TREATMENT APPARATUS AND METHOD FOR TREATING SUBSTRATE
Organization Name
Inventor(s)
Kensuke Demura of Yokohama-shi (JP)
Satoshi Nakamura of Yokohama-shi (JP)
Masaya Kamiya of Yokohama-shi (JP)
Minami Nakamura of Yokohama-shi (JP)
Kosuke Takai of Yokohama-shi (JP)
Kaori Umezawa of Fujisawa-shi (JP)
SUBSTRATE TREATMENT APPARATUS AND METHOD FOR TREATING SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18469619 titled 'SUBSTRATE TREATMENT APPARATUS AND METHOD FOR TREATING SUBSTRATE
Simplified Explanation
The substrate treatment apparatus described in the patent application incorporates a method of removing contaminants adhered to a substrate surface by freezing a liquid film on the surface and then incorporating the contaminant into the frozen film. The apparatus includes a placement part to rotate the substrate, a liquid supply part to supply liquid via a nozzle to the frozen film, a moving part to move the nozzle parallel to the substrate surface, and a controller to control the rotation of the substrate, the supply of liquid, and the movement of the nozzle.
- The apparatus rotates the substrate to control the placement part, supplies liquid to the frozen film to incorporate the contaminant by controlling the liquid supply part, and moves the nozzle from the perimeter edge vicinity to the rotation center vicinity of the substrate by controlling the moving part.
Potential Applications
The technology described in the patent application could be applied in industries where substrate cleaning and contaminant removal are crucial, such as semiconductor manufacturing, optical lens production, and solar panel fabrication.
Problems Solved
This technology solves the problem of efficiently and effectively removing contaminants adhered to substrate surfaces without damaging the substrate itself. It provides a method for cleaning substrates that is precise and controlled.
Benefits
The benefits of this technology include improved substrate cleanliness, increased production efficiency, reduced risk of damage to substrates during cleaning processes, and overall cost savings for industries that rely on clean substrates for their products.
Potential Commercial Applications
The potential commercial applications of this technology could be in the semiconductor industry for cleaning silicon wafers, in the optics industry for cleaning lenses, and in the solar industry for cleaning solar panels.
Possible Prior Art
One possible prior art for this technology could be traditional substrate cleaning methods using chemical solutions or mechanical scrubbing, which may not be as precise or efficient as the method described in the patent application.
Unanswered Questions
How does the apparatus ensure that the liquid supply is sufficient to remove all contaminants from the substrate surface?
The patent application does not provide specific details on how the apparatus determines the optimal amount of liquid supply needed to effectively remove contaminants from the substrate surface.
What is the expected lifespan of the components of the apparatus, and how often would maintenance be required?
The patent application does not mention the expected lifespan of the components of the apparatus or the frequency of maintenance needed to ensure the proper functioning of the equipment.
Original Abstract Submitted
According to one embodiment a substrate treatment apparatus incorporates, into a frozen film, a contaminant adhered to a substrate surface by freezing a liquid film on the surface. The apparatus includes a placement part configured to rotate the substrate, a liquid supply part configured to supply a liquid via a nozzle to the frozen film including the contaminant, a moving part configured to move the nozzle parallel to the substrate surface, and a controller configured to control a rotation of the substrate by the placement part, a supply of the liquid by the liquid supply part, and a movement of the nozzle by the moving part. The controller rotates the substrate by controlling the placement part, supplies the liquid to the frozen film by controlling the liquid supply part, and moves the nozzle from a perimeter edge vicinity to a rotation center vicinity of the substrate by controlling the moving part.
