18468966. ETCHING CONTROL SYSTEM AND ETCHING CONTROL METHOD simplified abstract (TOKYO ELECTRON LIMITED)
Contents
- 1 ETCHING CONTROL SYSTEM AND ETCHING CONTROL METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ETCHING CONTROL SYSTEM AND ETCHING CONTROL METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
ETCHING CONTROL SYSTEM AND ETCHING CONTROL METHOD
Organization Name
Inventor(s)
Toyohisa Tsuruda of Koshi City (JP)
Hiroshi Marumoto of Koshi City (JP)
Masashi Enomoto of Koshi City (JP)
ETCHING CONTROL SYSTEM AND ETCHING CONTROL METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18468966 titled 'ETCHING CONTROL SYSTEM AND ETCHING CONTROL METHOD
Simplified Explanation
The abstract describes an etching control system that includes a prediction device and an etching control device. The prediction device calculates the process parameter based on the distribution of an etching amount within a substrate's surface, while the etching control device updates the process recipe and controls the operations of multiple nozzles accordingly.
- Prediction device calculates process parameter based on etching amount distribution and process parameter relationship.
- Etching control device updates process recipe and controls multiple nozzles based on the updated process parameter.
Potential Applications
This technology could be applied in industries such as semiconductor manufacturing, where precise control of etching processes is crucial for producing high-quality products.
Problems Solved
1. Ensures accurate and consistent etching of substrates. 2. Improves efficiency by optimizing process parameters.
Benefits
1. Enhanced quality control in etching processes. 2. Increased productivity and cost-effectiveness. 3. Enables customization of etching processes for different substrates.
Potential Commercial Applications
Optimizing Etching Processes for Semiconductor Manufacturing
Possible Prior Art
Prior art in the field of semiconductor manufacturing may include similar systems for controlling etching processes, but this specific combination of prediction and control devices may be a novel innovation.
What are the key components of the etching control system described in the abstract?
The key components of the etching control system are the prediction device, which calculates the process parameter based on the distribution of the etching amount within the substrate, and the etching control device, which updates the process recipe and controls the operations of multiple nozzles according to the updated process parameter.
How does the etching control system improve the efficiency of etching processes?
The etching control system improves the efficiency of etching processes by ensuring accurate and consistent etching of substrates, optimizing process parameters based on the distribution of the etching amount, and enabling customization of etching processes for different substrates.
Original Abstract Submitted
An etching control system includes a prediction device and an etching control device. The prediction device includes a calculator configured to calculate, by using a model indicating a relationship between distribution of an etching amount within a surface of a substrate and a process parameter, which is a parameter of controlling operations of multiple nozzles configured to etch the substrate, the process parameter corresponding to distribution of a designated etching amount. The etching control device includes an updating unit configured to update a process recipe, which is information including a discharge time, a discharge position, and a moving speed of each of the multiple nozzles, based on the process parameter; and an operation controller configured to control the operations of the multiple nozzles according to the process recipe updated by the updating unit.
