18468928. ETCHING CONTROL SYSTEM AND ETCHING CONTROL METHOD simplified abstract (TOKYO ELECTRON LIMITED)
Contents
- 1 ETCHING CONTROL SYSTEM AND ETCHING CONTROL METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ETCHING CONTROL SYSTEM AND ETCHING CONTROL METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
ETCHING CONTROL SYSTEM AND ETCHING CONTROL METHOD
Organization Name
Inventor(s)
Toyohisa Tsuruda of Koshi City (JP)
Hiroshi Marumoto of Koshi City (JP)
Masashi Enomoto of Koshi City (JP)
ETCHING CONTROL SYSTEM AND ETCHING CONTROL METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18468928 titled 'ETCHING CONTROL SYSTEM AND ETCHING CONTROL METHOD
Simplified Explanation
The abstract describes an etching control system that includes a prediction device and an etching control device. The prediction device updates a model indicating the relationship between the distribution of an etching amount on a substrate surface and a process parameter, calculates the process parameter based on the model, and provides the calculated process parameter. The etching control device acquires the process parameter and controls the operations of multiple nozzles based on the acquired process parameter.
- Prediction device updates a model indicating the relationship between etching amount distribution and process parameters.
- Calculator calculates process parameters based on the updated model.
- Etching control device acquires and uses the calculated process parameters to control multiple nozzles.
Potential Applications
The technology can be applied in semiconductor manufacturing, printed circuit board production, and microfabrication processes.
Problems Solved
1. Improved control and optimization of etching processes. 2. Enhanced accuracy in etching amount distribution on substrates.
Benefits
1. Increased efficiency in etching operations. 2. Reduction in material wastage. 3. Enhanced product quality and consistency.
Potential Commercial Applications
Optimized etching control systems for semiconductor industry. SEO Optimized Title: "Optimized Etching Control Systems for Semiconductor Industry"
Possible Prior Art
One possible prior art could be traditional etching control systems that rely on fixed parameters for controlling the etching process.
Unanswered Questions
How does the system handle variations in substrate materials?
The abstract does not specify how the system adapts to different types of substrates and their unique characteristics.
What is the impact of environmental factors on the system's performance?
The abstract does not mention how the system accounts for environmental conditions that may affect the etching process.
Original Abstract Submitted
An etching control system includes a prediction device and an etching control device. The prediction device includes an updating unit configured to update, to optimize a model indicating a relationship between distribution of an etching amount within a surface of a substrate and a process parameter, which is a parameter of controlling operations of multiple nozzles configured to etch the substrate, a parameter of the model; a calculator configured to calculate the process parameter corresponding to distribution of a designated etching amount by using the model whose parameter has been updated by the updating unit; and a provider configured to provide the process parameter calculated by the calculator. The etching control device includes an acquisition unit configured to acquire the process parameter; and an operation controller configured to control the operations of the multiple nozzles by using the process parameter acquired by the acquisition unit.
