18468650. CERAMIC SINTERED BODY SUBSTRATE, LIGHT-EMITTING DEVICE, AND MANUFACTURING METHODS THEREOF simplified abstract (NICHIA CORPORATION)
Contents
- 1 CERAMIC SINTERED BODY SUBSTRATE, LIGHT-EMITTING DEVICE, AND MANUFACTURING METHODS THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CERAMIC SINTERED BODY SUBSTRATE, LIGHT-EMITTING DEVICE, AND MANUFACTURING METHODS THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
CERAMIC SINTERED BODY SUBSTRATE, LIGHT-EMITTING DEVICE, AND MANUFACTURING METHODS THEREOF
Organization Name
Inventor(s)
Masaaki Katsumata of Anan-shi (JP)
Takashi Kawamata of Anan-shi (JP)
Akiko Nagae of Komatsushima-shi (JP)
CERAMIC SINTERED BODY SUBSTRATE, LIGHT-EMITTING DEVICE, AND MANUFACTURING METHODS THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18468650 titled 'CERAMIC SINTERED BODY SUBSTRATE, LIGHT-EMITTING DEVICE, AND MANUFACTURING METHODS THEREOF
Simplified Explanation
The method described in the patent application involves manufacturing a ceramic sintered body substrate by applying a first metal paste containing metal powders, active metal powders, and inorganic fillers onto a ceramic substrate, and then firing the substrate at a temperature equal to or higher than the melting point of the metal powders.
- First metal paste contains metal powders, active metal powders, and inorganic fillers excluding metals.
- Firing temperature is equal to or higher than the melting point of the metal powders.
Potential Applications
The technology could be applied in the manufacturing of electronic components, sensors, and other high-temperature applications where a strong and conductive ceramic substrate is required.
Problems Solved
1. Improved adhesion and conductivity in ceramic substrates. 2. Enhanced mechanical properties of ceramic sintered bodies.
Benefits
1. Increased efficiency in electronic devices. 2. Enhanced durability and reliability of ceramic components.
Potential Commercial Applications
The technology could find applications in the production of high-performance electronic devices, aerospace components, and medical devices.
Possible Prior Art
Prior art may include methods for manufacturing ceramic-metal composites or sintered bodies using different compositions and firing techniques.
Unanswered Questions
How does this technology compare to traditional methods of manufacturing ceramic-metal composites?
This article does not provide a direct comparison between this technology and traditional methods, leaving the reader to wonder about the specific advantages and disadvantages of this new approach.
What are the specific industries that could benefit the most from this technology?
While potential applications are mentioned, the article does not delve into the specific industries that could see the greatest impact from the implementation of this technology.
Original Abstract Submitted
A method for manufacturing a ceramic sintered body substrate includes of disposing a first metal paste on a surface of a ceramic substrate, and of firing the ceramic substrate on which the first metal paste is disposed. In the disposing the first metal paste, the first metal paste contains a plurality of first metal powders, a plurality of active metal powders, and a plurality of inorganic fillers excluding metals, and in the firing the ceramic substrate, a firing temperature is equal to or higher than a melting point of the first metal powders.
