18467245. COOLING STAGE FOR COOLING DOWN A HEATED CARRIER simplified abstract (NEXPERIA B.V.)

COOLING STAGE FOR COOLING DOWN A HEATED CARRIER

Organization Name

NEXPERIA B.V.

Inventor(s)

Arne De Roest of Nijmegen (NL)

Roland Hanegraaf of Nijmegen (NL)

Patrick Houben of Nijmegen (NL)

COOLING STAGE FOR COOLING DOWN A HEATED CARRIER - A simplified explanation of the abstract

This abstract first appeared for US patent application 18467245 titled 'COOLING STAGE FOR COOLING DOWN A HEATED CARRIER

Simplified Explanation

The present disclosure is about a cooling stage for cooling down a heated carrier with mounted components, a pick-and-place apparatus including the cooling stage, and a method for cooling the carrier. The cooling stage uses supporting members to separate the carrier from a cooling body, reducing dependency on the type of carrier used.

• The cooling stage utilizes supporting members to keep the heated carrier separated from a cooling body.
• Thermal convection between the heated carrier and the cooling body is relied upon to cool down the carrier.
• Different types of carriers may only require different supporting members or a different temperature of the cooling body for effective cooling.

Potential Applications

The technology could be applied in various industries where components need to be cooled down after being mounted on a carrier, such as electronics manufacturing, automotive assembly, and medical device production.

Problems Solved

1. Efficient cooling of heated carriers with mounted components. 2. Reduced dependency on the type of carrier used for cooling purposes.

Benefits

1. Improved cooling efficiency. 2. Simplified cooling process. 3. Versatility in cooling different types of carriers.

Potential Commercial Applications

Optimized Cooling Stage for Component Mounting: Enhancing the efficiency of manufacturing processes by ensuring components are adequately cooled after mounting.

Possible Prior Art

One possible prior art could be cooling stages that rely on direct contact between the carrier and the cooling body, which may limit their effectiveness based on the type of carrier used.

How does the cooling stage compare to traditional cooling methods in terms of efficiency and cost-effectiveness?

The article does not provide a direct comparison between the cooling stage and traditional cooling methods in terms of efficiency and cost-effectiveness. This information would be valuable for potential users looking to adopt this technology.

Are there any specific requirements for the supporting members used in the cooling stage?

The article mentions using different supporting members for different types of carriers, but it does not detail any specific requirements or considerations for selecting or designing these supporting members. Understanding these requirements could be crucial for implementing the technology effectively.

Original Abstract Submitted

The present disclosure relates to a cooling stage for cooling down a heated carrier on which a plurality of components has been mounted. Further aspects of the present disclosure relate to a pick-and-place apparatus that includes such a cooling stage and to a method for cooling down a heated carrier on which a plurality of components has been mounted. The cooling stage according to an aspect of the present disclosure uses supporting members for keeping the heated carrier separated from a cooling body. By relying on thermal convection between the heated carrier and the cooling body, dependency of the cooling stage on the type of carrier used is reduced compared to known cooling stages. For example, for different types of carries, it generally suffices to use different supporting members, e.g. having a different height, and/or to use a different temperature of the cooling body.