18465524. DISCHARGING DEVICE AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

DISCHARGING DEVICE AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Jong Han Kim of Cheonan-si (KR)

Jin Uk Song of Suwon-si (KR)

Rae Taek Oh of Cheonan-si (KR)

Ji Ho Kim of Cheonan-si (KR)

Ho Kyung Kang of Suwon-si (KR)

Kwang Sung Son of Suwon-si (KR)

DISCHARGING DEVICE AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18465524 titled 'DISCHARGING DEVICE AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME

Simplified Explanation

The patent application describes a substrate treating apparatus that includes a substrate support structure with a spin head, treating liquid recovery containers, and a discharging device with first and second nozzles for chemical and deionized water discharge, respectively. The first nozzle has a surface pattern for roughness on its inner surface.

• Substrate treating apparatus with spin head for substrate support and rotation
• Treating liquid recovery containers for recovering substrate treating liquid
• Discharging device with first nozzle for chemical discharge and second nozzle for deionized water discharge
• First nozzle with surface pattern for roughness on inner surface

Potential Applications

The technology described in the patent application could be applied in industries such as semiconductor manufacturing, electronics production, and other fields requiring precise substrate treatment processes.

Problems Solved

The substrate treating apparatus addresses the need for efficient and controlled substrate treatment processes, ensuring uniformity and quality in the treatment of substrates.

Benefits

Some benefits of this technology include improved substrate treatment accuracy, reduced waste of treating liquids, and enhanced overall efficiency in substrate treatment processes.

Potential Commercial Applications

The substrate treating apparatus could find commercial applications in semiconductor fabrication facilities, electronics manufacturing plants, and research institutions requiring advanced substrate treatment capabilities.

Possible Prior Art

One possible prior art could be similar substrate treating apparatus with spin heads and liquid recovery systems, but without the specific design features and surface patterns described in this patent application.

How does the surface pattern on the first nozzle improve substrate treatment processes?

The surface pattern on the first nozzle is designed to provide roughness on the inner surface, which may help in controlling the flow and dispersion of the chemical onto the substrate. This could potentially improve the uniformity and effectiveness of the chemical treatment process.

What are the specific materials used in the construction of the treating liquid recovery containers?

The patent application does not specify the materials used in the construction of the treating liquid recovery containers. It would be important to know the materials to assess their compatibility with different types of treating liquids and their durability in long-term use.

Original Abstract Submitted

According to at least one example embodiment, a substrate treating apparatus includes a substrate support structure including a spin head, the substrate support structure configured to support a substrate, and rotate the substrate, at least one treating liquid recovery container configured to recover at least one substrate treating liquid, and a discharging device including a first nozzle and a second nozzle, the first nozzle configured to discharge a chemical onto the substrate, and the second nozzle configured to discharge deionized water onto the substrate, wherein the first nozzle includes a surface pattern configured to provide roughness on an inner surface of the first nozzle.