18464759. MEMS DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (ROHM CO., LTD.)

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MEMS DEVICE AND MANUFACTURING METHOD THEREOF

Organization Name

ROHM CO., LTD.

Inventor(s)

Martin Wilfried Heller of Kyoto (JP)

Daisuke Kaminishi of Kyoto (JP)

MEMS DEVICE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 18464759 titled 'MEMS DEVICE AND MANUFACTURING METHOD THEREOF

Simplified Explanation

The present disclosure provides a MEMS device. The MEMS device includes: a substrate; a recess, disposed in the substrate; a movable portion, hollowly supported in the recess; and an isolation joint, inserted into a predetermined position of the movable portion and electrically insulating both sides of the movable portion. A shortest distance between a bottom of the recess and the movable portion is less than a distance between the bottom of the recess and the isolation joint.

  • MEMS device with a movable portion supported in a recess
  • Isolation joint electrically insulating the movable portion
  • Specific distance requirements between components for optimal functionality

Potential Applications

The MEMS device can be used in:

  • Accelerometers
  • Gyroscopes
  • Pressure sensors

Problems Solved

  • Electrical interference between components
  • Mechanical stability of the movable portion

Benefits

  • Improved accuracy and sensitivity
  • Reduced risk of malfunction due to electrical shorts

Potential Commercial Applications

Optimizing MEMS devices for:

  • Consumer electronics
  • Automotive sensors

Possible Prior Art

Prior art may include:

  • MEMS devices with similar isolation joint configurations
  • Research on improving MEMS device performance

Unanswered Questions

How does the isolation joint impact the overall durability of the MEMS device?

The article does not delve into the long-term effects of the isolation joint on the device's lifespan.

Are there any limitations to the specific distance requirements mentioned in the abstract?

The article does not discuss any potential drawbacks or challenges related to maintaining these distances in manufacturing processes.


Original Abstract Submitted

The present disclosure provides a MEMS device. The MEMS device includes: a substrate; a recess, disposed in the substrate; a movable portion, hollowly supported in the recess; and an isolation joint, inserted into a predetermined position of the movable portion and electrically insulating both sides of the movable portion. A shortest distance between a bottom of the recess and the movable portion is less than a distance between the bottom of the recess and the isolation joint.