18464258. COOLING DEVICE AND ELECTRONIC APPARATUS SYSTEM simplified abstract (FUJIFILM Corporation)

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COOLING DEVICE AND ELECTRONIC APPARATUS SYSTEM

Organization Name

FUJIFILM Corporation

Inventor(s)

Yuta Watanabe of Saitama-shi (JP)

Yoshihiro Hayashi of Saitama-shi (JP)

Nobuaki Suzuki of Saitama-shi (JP)

Kouhei Awazu of Saitama-shi (JP)

COOLING DEVICE AND ELECTRONIC APPARATUS SYSTEM - A simplified explanation of the abstract

This abstract first appeared for US patent application 18464258 titled 'COOLING DEVICE AND ELECTRONIC APPARATUS SYSTEM

Simplified Explanation

The abstract describes a cooling device for electronic apparatus that includes a heat sink with fins for heat radiation and an attachment mechanism for attaching the heat sink to the outer surface of the apparatus. The attachment mechanism overlaps with the fins.

  • The cooling device includes a heat sink with fins for heat radiation.
  • An attachment mechanism is provided to attach the heat sink to the outer surface of an electronic apparatus.
  • The attachment mechanism overlaps with the fins of the heat sink.

Potential Applications

  • Cooling electronic devices such as computers, laptops, servers, or gaming consoles.
  • Cooling power electronics, such as inverters or motor drives.
  • Cooling LED lighting systems or other heat-generating components in various industries.

Problems Solved

  • Overheating of electronic devices due to insufficient cooling systems.
  • Difficulty in attaching and detaching heat sinks securely to electronic apparatus.
  • Limited space for heat sink attachment due to the presence of other components.

Benefits

  • Efficient heat dissipation to prevent overheating and improve device performance.
  • Secure attachment mechanism ensures stability and reliability.
  • Overlapping attachment mechanism allows for better utilization of limited space.


Original Abstract Submitted

There is provided a cooling device including: a heat sink on which a plurality of fins for heat radiation are formed; and an attachment mechanism for attachably and detachably attaching the heat sink to an outer surface of an electronic apparatus, at least a part of the attachment mechanism overlapping a formation region of the fins.

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