18464223. LASER MACHINING HEAD, AND LASER MACHINING SYSTEM COMPRISING SAME simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
LASER MACHINING HEAD, AND LASER MACHINING SYSTEM COMPRISING SAME
Organization Name
Panasonic Intellectual Property Management Co., Ltd.
Inventor(s)
WATARU Takahashi of Osaka (JP)
LASER MACHINING HEAD, AND LASER MACHINING SYSTEM COMPRISING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18464223 titled 'LASER MACHINING HEAD, AND LASER MACHINING SYSTEM COMPRISING SAME
Simplified Explanation
The abstract describes a laser processing head that includes a housing and multiple optical components. The housing has two light entrance ports for two different laser beams and a light irradiation port. The optical components include a bend mirror, a dichroic mirror, an aperture, and a detection-side condensing lens. The laser beams transmitted through the condensing lens are received by an image sensor. The aperture can reduce the diameters of the laser beams incident on the condensing lens.
- The laser processing head includes a housing with multiple optical components.
- The housing has two light entrance ports for two different laser beams and a light irradiation port.
- The optical components include a bend mirror, a dichroic mirror, an aperture, and a detection-side condensing lens.
- The laser beams transmitted through the condensing lens are received by an image sensor.
- The aperture is capable of reducing the diameters of the laser beams incident on the condensing lens.
Potential Applications
- Laser cutting and engraving machines
- Laser welding and soldering equipment
- Laser marking and etching systems
Problems Solved
- Efficiently directing and focusing multiple laser beams
- Reducing the diameters of laser beams for improved precision
- Enabling detection and analysis of the laser beams
Benefits
- Improved accuracy and precision in laser processing
- Enhanced control and manipulation of laser beams
- Simplified setup and operation of laser processing systems
Original Abstract Submitted
Laser processing head () includes housing () and a plurality of optical components. Housing () includes first and second light entrance ports (a) and (b) through which first and second laser beams (A) and (B) are incident, and light irradiation port (). Second laser beam (B) has a wavelength different from first laser beam (A). The plurality of optical components include bend mirror (), dichroic mirror (), aperture (), and detection-side condensing lens (). First and second laser beams (A) and (B) transmitted through detection-side condensing lens () are received by image sensor (). Aperture () is configured to be able to reduce diameters of first and second laser beams (A) and (B) incident on detection-side condensing lens ().
