18464075. POWER CONVERSION APPARATUS simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
Contents
POWER CONVERSION APPARATUS
Organization Name
Panasonic Intellectual Property Management Co., Ltd.
Inventor(s)
POWER CONVERSION APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18464075 titled 'POWER CONVERSION APPARATUS
Simplified Explanation
The abstract describes a power conversion apparatus that includes a semiconductor component for power conversion, a heat transfer member, and a housing. The heat transfer member is fixed to the semiconductor component and is thermally connected to a heat dissipation surface on the semiconductor component. The housing has a heat dissipation wall portion with a fitting portion that fits to the heat transfer member. The contact area between the fitting portion and the heat transfer member is larger than the heat dissipation surface of the semiconductor component. The occupied area of the fitting portion is smaller than the surface area of the semiconductor component with the heat dissipation surface.
- The power conversion apparatus includes a semiconductor component and a heat transfer member.
- The heat transfer member is fixed to the semiconductor component and is thermally connected to a heat dissipation surface on the semiconductor component.
- The housing of the apparatus has a heat dissipation wall portion with a fitting portion that fits to the heat transfer member.
- The contact area between the fitting portion and the heat transfer member is larger than the heat dissipation surface of the semiconductor component.
- The occupied area of the fitting portion is smaller than the surface area of the semiconductor component with the heat dissipation surface.
Potential Applications
- Power conversion systems
- Renewable energy systems
- Electric vehicle charging systems
Problems Solved
- Efficient heat dissipation in power conversion apparatus
- Improved thermal management in semiconductor components
Benefits
- Enhanced heat transfer and dissipation capabilities
- Compact design with efficient use of space
- Improved reliability and performance of power conversion systems
Original Abstract Submitted
A power conversion apparatus, comprising: a semiconductor component for power conversion; a heat transfer member to which the semiconductor component is fixed such that the heat transfer member is thermally connected to a heat dissipation surface formed on at least one surface of the semiconductor component; and a housing, wherein the housing includes a heat dissipation wall portion, a fitting portion that fits to the heat transfer member is formed on the heat dissipation wall portion at an inside of the housing space, an area of contact between the fitting portion and the heat transfer member is greater than an area of the heat dissipation surface of the semiconductor component, and an occupied area of the fitting portion as seen in plan view is smaller than an area of the at least one surface of the semiconductor component on which the heat dissipation surface is formed.
