18462807. ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
ELECTRONIC DEVICE
Organization Name
Inventor(s)
Jonggwang Jang of Suwon-si (KR)
ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18462807 titled 'ELECTRONIC DEVICE
Simplified Explanation
The patent application describes an electronic device with a housing and a printed circuit board. The housing consists of a front plate, a rear plate, and a side frame. The printed circuit board is placed between the front and rear plates and contains a front end module (FEM) and a heating element made of a thermally conductive material. The side frame is divided into two metal portions, which are separated by a non-conductive segmentation member. The first metal portion is connected to the front end module, while the second metal portion is connected to the heating element through heat transfer members made of a thermal interface material.
- The electronic device has a housing with a front plate, rear plate, and side frame.
- The printed circuit board is located between the front and rear plates and contains a front end module and a heating element.
- The side frame is segmented into two metal portions separated by a non-conductive material.
- The first metal portion is connected to the front end module.
- The second metal portion is connected to the heating element through heat transfer members made of a thermal interface material.
Potential applications of this technology:
- Consumer electronics such as smartphones, tablets, or laptops.
- Industrial equipment with electronic components that require heating or cooling.
- Medical devices that need precise temperature control.
Problems solved by this technology:
- Efficient heat transfer between the heating element and the side frame.
- Prevention of electrical interference between the front end module and the heating element.
- Enhanced thermal management within the electronic device.
Benefits of this technology:
- Improved heat dissipation, leading to better performance and longevity of electronic components.
- Reduced risk of overheating and damage to the device.
- Enhanced reliability and stability of the electronic device.
Original Abstract Submitted
In various embodiments, an electronic device may comprise: a housing including a front plate, a rear plate opposite to the front plate, and a side frame surrounding the space between the front plate and the rear plate; and a printed circuit board disposed in the space and having a front end module (FEM) and a heating element comprising a thermally conductive material mounted thereon, wherein the side frame is segmented into at least a first metal portion and a second metal portion, a segmentation member comprising a non-conductive material is disposed between the first metal portion and the second metal portion, and the first metal portion is electrically connected to the front end module, and the second metal portion is connected to the heating element by heat transfer members comprising a thermal interface material.
