18460934. VIRTUAL METROLOGY METHODS FOR WAFERS, PREDICTION METHODS FOR CIRCUIT CHARACTERISTICS OF WAFERS AND PROCESS CONTROL SYSTEMS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 VIRTUAL METROLOGY METHODS FOR WAFERS, PREDICTION METHODS FOR CIRCUIT CHARACTERISTICS OF WAFERS AND PROCESS CONTROL SYSTEMS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 VIRTUAL METROLOGY METHODS FOR WAFERS, PREDICTION METHODS FOR CIRCUIT CHARACTERISTICS OF WAFERS AND PROCESS CONTROL SYSTEMS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Original Abstract Submitted
VIRTUAL METROLOGY METHODS FOR WAFERS, PREDICTION METHODS FOR CIRCUIT CHARACTERISTICS OF WAFERS AND PROCESS CONTROL SYSTEMS
Organization Name
Inventor(s)
VIRTUAL METROLOGY METHODS FOR WAFERS, PREDICTION METHODS FOR CIRCUIT CHARACTERISTICS OF WAFERS AND PROCESS CONTROL SYSTEMS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18460934 titled 'VIRTUAL METROLOGY METHODS FOR WAFERS, PREDICTION METHODS FOR CIRCUIT CHARACTERISTICS OF WAFERS AND PROCESS CONTROL SYSTEMS
Simplified Explanation
The abstract describes a virtual metrology method for predicting the physical characteristics of a target wafer in a semiconductor process based on data collected from sample wafers.
- Data collection includes process path information of manufactured wafers and measured values of sample wafers.
- Measured values of sample wafers are classified according to process paths and a moving average value is calculated for each process path.
- A moving average value corresponding to the process path of the target wafer is determined as the predicted value of its physical characteristics.
Potential Applications
This technology can be applied in semiconductor manufacturing processes to predict the physical characteristics of wafers without the need for direct measurement, saving time and resources.
Problems Solved
1. Eliminates the need for direct measurement of target wafers, reducing production time and costs. 2. Provides accurate predictions of physical characteristics based on historical data, improving process efficiency.
Benefits
1. Increased efficiency in semiconductor manufacturing processes. 2. Cost savings through reduced measurement requirements. 3. Improved quality control through accurate predictions of wafer characteristics.
Original Abstract Submitted
A virtual metrology method for a wafer includes collecting log data including process path information of wafers manufactured in a semiconductor process; collecting measured values of sample wafers of which physical characteristics are measured in the semiconductor process, the sample wafers being a group of wafers selected from among the manufactured wafers; classifying measured values of the sample wafers according to process paths based on the process path information; calculating a moving average value of measured values classified for each process path; and determining a moving average value corresponding to a process path of an unmeasured target wafer from among the manufactured wafers as a predicted value of the physical characteristics of the target wafer.
