18459766. CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
Organization Name
Inventor(s)
Seung Hyun Cho of Suwon-si (KR)
CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18459766 titled 'CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
Simplified Explanation
The chip-on-film package described in the abstract includes a lower base film, an upper base film, semiconductor chips mounted on each film, and an interposer film between the base films.
- Lower base film with first and second surfaces
- Upper base film with third and fourth surfaces
- First semiconductor chip mounted on the second surface of the lower base film
- Second semiconductor chip mounted on the third surface of the upper base film
- Interposer film between the lower and upper base films
Potential Applications
The chip-on-film package technology can be used in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics.
Problems Solved
This technology helps in reducing the overall size of electronic devices by providing a compact packaging solution for semiconductor chips.
Benefits
The chip-on-film package offers improved thermal performance, reduced power consumption, and enhanced reliability for electronic devices.
Potential Commercial Applications
"Chip-on-film Package Technology for Compact Electronic Devices"
Possible Prior Art
Prior art related to chip-on-film packages includes traditional chip packaging methods such as wire bonding and flip chip technology.
Unanswered Questions
How does the chip-on-film package technology impact the overall cost of electronic devices?
The cost implications of implementing chip-on-film packages in electronic devices are not discussed in the abstract. Further research is needed to understand the cost-effectiveness of this technology.
What are the environmental implications of using chip-on-film packages in electronic devices?
The environmental impact of chip-on-film packages, in terms of recyclability and sustainability, is not addressed in the abstract. Future studies could explore the eco-friendliness of this packaging technology.
Original Abstract Submitted
A chip-on-film package includes: a lower base film including a first surface and a second surface, which are opposite to each other; an upper base film including a third surface and a fourth surface, which are opposite to each other, and is disposed on the lower base film; a first semiconductor chip mounted on the second surface of the lower base film; a second semiconductor chip mounted on the third surface of the upper base film; and an interposer film interposed between the lower and upper base films, wherein the second and third surfaces face each other.
