18459431. CONDUCTOR FORMING APPARATUS AND CONDUCTOR FORMING METHOD simplified abstract (Honda Motor Co., Ltd.)

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CONDUCTOR FORMING APPARATUS AND CONDUCTOR FORMING METHOD

Organization Name

Honda Motor Co., Ltd.

Inventor(s)

Mikito Saito of Tokyo (JP)

Ryosuke Fukuchi of Tokyo (JP)

CONDUCTOR FORMING APPARATUS AND CONDUCTOR FORMING METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18459431 titled 'CONDUCTOR FORMING APPARATUS AND CONDUCTOR FORMING METHOD

Simplified Explanation

The conductor forming apparatus described in the patent application is designed to form a wave winding coil group by folding a conductor. Here is a simplified explanation of the innovation:

  • The apparatus includes a folding jig with a support plate and guide protrusions.
  • The support plate has a tip that serves as the starting point for folding the conductor.
  • Guide protrusions on the support plate hold the conductor before folding from both sides in a width direction.
  • Each guide protrusion has a guide surface that guides the folding operation of the conductor from the start.

Potential Applications

The technology can be applied in the manufacturing of electrical coils, transformers, and inductor components.

Problems Solved

This technology solves the problem of efficiently and accurately forming wave winding coil groups by providing a precise folding mechanism.

Benefits

The benefits of this technology include improved efficiency in coil manufacturing processes, increased precision in coil formation, and potentially reduced production costs.

Potential Commercial Applications

The technology can be utilized in industries such as electronics, automotive, renewable energy, and industrial machinery for the production of various electrical components.

Possible Prior Art

One possible prior art could be traditional methods of manually folding conductors to form coils, which may lack precision and efficiency compared to the apparatus described in the patent application.

Unanswered Questions

How does the apparatus handle different types of conductors with varying thicknesses or materials?

The patent application does not provide specific details on how the apparatus accommodates different types of conductors. Further information on the adaptability of the apparatus to various conductor materials and thicknesses would be beneficial.

Are there any limitations to the size or length of conductors that can be processed using this apparatus?

The patent application does not mention any limitations regarding the size or length of conductors that can be processed. Understanding the maximum capacity of the apparatus in terms of conductor size and length would be important for potential users.


Original Abstract Submitted

A conductor forming apparatus that forms a wave winding coil group by folding a conductor, in which the conductor forming apparatus includes: a folding jig that is arranged on an inside of a folding direction of the conductor, the folding jig including a support plate with a tip serving as a starting point for folding the conductor, and a plurality of guide protrusions arranged on a side of the tip of the support plate so as to hold the conductor before folding from both sides in a width direction, the plurality of guide protrusions each including a guide surface that can guide a folding operation of the conductor from the start of folding.