18457983. PATTERN FORMATION METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND IMPRINT APPARATUS simplified abstract (Kioxia Corporation)
Contents
PATTERN FORMATION METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND IMPRINT APPARATUS
Organization Name
Inventor(s)
Masaki Mitsuyasu of Kuwana Mie (JP)
Anupam Mitra of Yokkaichi Mie (JP)
PATTERN FORMATION METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND IMPRINT APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18457983 titled 'PATTERN FORMATION METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND IMPRINT APPARATUS
Simplified Explanation
The abstract describes a method for pattern formation on a substrate using a template and alignment marks. Here is a simplified explanation of the patent application:
- The method involves holding a substrate on a suction chuck with outer and inner suction regions.
- The substrate has alignment marks at the outer edge and inner region.
- A template is pressed against a resin film on the substrate in a shot region.
- Position alignment is done using the alignment marks by adjusting suction force for the outer region to change substrate warpage.
Potential Applications of this Technology:
- Semiconductor manufacturing
- Printed circuit board production
- Microelectronics fabrication
Problems Solved by this Technology:
- Accurate alignment of patterns on substrates
- Minimization of warpage during template pressing
Benefits of this Technology:
- Improved precision in pattern formation
- Increased efficiency in manufacturing processes
- Reduction in material wastage
Potential Commercial Applications of this Technology:
- Electronics industry
- Semiconductor equipment manufacturers
- Research institutions
Possible Prior Art:
- Alignment methods using alignment marks on substrates
- Template pressing techniques in manufacturing processes
Unanswered Questions: 1. How does the method handle variations in substrate thickness? 2. Are there any limitations to the size of substrates that can be processed using this method?
Original Abstract Submitted
According to one embodiment, a pattern formation method includes holding a substrate on a suction chuck that an outer suction region for an outer edge portion of the substrate and an inner suction region for an inner region of the substrate. A partial shot region at an outer edge of the substrate has a first alignment mark in the inner region and a second alignment mark at the outer edge portion. While a template is being pressed against a resin film in the shot region, position alignment using the second and fourth alignment marks is performed by adjusting a suction force for the outer suction region for changing a warpage amount of the substrate while observing the second and fourth alignment marks through the template.
