18456970. UNDERFILL COMPOSITION, COATING FILM, CURED FILM, MULTILAYER INTERCONNECTION BOARD, AND MANUFACTURING METHOD OF MULTILAYER INTERCONNECTION BOARD simplified abstract (FUJIFILM Corporation)
Contents
- 1 UNDERFILL COMPOSITION, COATING FILM, CURED FILM, MULTILAYER INTERCONNECTION BOARD, AND MANUFACTURING METHOD OF MULTILAYER INTERCONNECTION BOARD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 UNDERFILL COMPOSITION, COATING FILM, CURED FILM, MULTILAYER INTERCONNECTION BOARD, AND MANUFACTURING METHOD OF MULTILAYER INTERCONNECTION BOARD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Original Abstract Submitted
UNDERFILL COMPOSITION, COATING FILM, CURED FILM, MULTILAYER INTERCONNECTION BOARD, AND MANUFACTURING METHOD OF MULTILAYER INTERCONNECTION BOARD
Organization Name
Inventor(s)
Junji Kawaguchi of Haibara-gun (JP)
UNDERFILL COMPOSITION, COATING FILM, CURED FILM, MULTILAYER INTERCONNECTION BOARD, AND MANUFACTURING METHOD OF MULTILAYER INTERCONNECTION BOARD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18456970 titled 'UNDERFILL COMPOSITION, COATING FILM, CURED FILM, MULTILAYER INTERCONNECTION BOARD, AND MANUFACTURING METHOD OF MULTILAYER INTERCONNECTION BOARD
Simplified Explanation
The present invention is an underfill composition for multilayer interconnection boards that offers excellent temporal stability and strong metal adhesiveness. The composition contains a polymer with a cyano group and a maleimide compound with a maleimide group. The cyano group content in 1 gram of the polymer ranges from 0.1 to 6 mmol/g.
- The underfill composition provides excellent temporal stability and good metal adhesiveness.
- It contains a polymer with a cyano group and a maleimide compound with a maleimide group.
- The cyano group content in the polymer is between 0.1 to 6 mmol/g.
Potential Applications
- Manufacturing of multilayer interconnection boards
- Electronics industry
- Semiconductor packaging
Problems Solved
- Lack of temporal stability in underfill compositions
- Weak metal adhesiveness in underfill compositions
Benefits
- Improved temporal stability
- Strong metal adhesiveness
- Enhanced performance of multilayer interconnection boards
Original Abstract Submitted
An object of the present invention is to provide an underfill composition having excellent temporal stability and good metal adhesiveness, a coating film formed of the underfill composition, a cured film, a multilayer interconnection board, and a manufacturing method of a multilayer interconnection board. The underfill composition of the present invention is an underfill composition containing a polymer and a maleimide compound having a maleimide group, in which the polymer has a cyano group, and a content of the cyano group included in 1 g of the polymer is 0.1 to 6 mmol/g.
