18456652. SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
Contents
- 1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Fuyuma Ito of Yokkaichi Mie (JP)
Jun Takagi of Yokkaichi Mie (JP)
Yosuke Maruyama of Yokkaichi Mie (JP)
Yuya Akeboshi of Yokkaichi Mie (JP)
Takashi Watanabe of Yokkaichi Mie (JP)
Hiroyasu Iimori of Nagoya Aichi (JP)
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18456652 titled 'SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Simplified Explanation
The patent application describes a substrate processing apparatus with roller pairs for rotating substrates, circulation grooves for supplying chemical solution, rinse solution, and drying fluid to the substrates.
- The substrate processing apparatus includes roller pairs for rotating substrates side by side with a predetermined interval.
- The apparatus has circulation grooves for supplying chemical solution, rinse solution, and drying fluid to the outer peripheral portions of the substrates.
Potential Applications
This technology could be used in semiconductor manufacturing, flat panel display production, and other industries requiring precise substrate processing.
Problems Solved
This technology solves the problem of efficiently and effectively processing multiple substrates in a controlled manner, ensuring uniformity and quality in the final product.
Benefits
The benefits of this technology include improved processing efficiency, enhanced substrate quality, and reduced chemical waste in the manufacturing process.
Potential Commercial Applications
Potential commercial applications of this technology include semiconductor fabrication facilities, display panel manufacturing plants, and other high-tech industries requiring advanced substrate processing equipment.
Possible Prior Art
One possible prior art for this technology could be similar substrate processing apparatus with circulation grooves, but with different configurations or functionalities.
Unanswered Questions
How does this technology compare to traditional substrate processing methods?
This article does not provide a direct comparison between this technology and traditional substrate processing methods. It would be interesting to know the specific advantages and disadvantages of this new apparatus compared to existing techniques.
What are the maintenance requirements for this substrate processing apparatus?
The article does not mention the maintenance requirements for this technology. Understanding the maintenance procedures and costs associated with this apparatus would be crucial for potential users.
Original Abstract Submitted
A substrate processing apparatus includes: a plurality of roller pairs configured to place a plurality of substrates, respectively, wherein the substrates are arranged side by side in a horizontal direction with a predetermined interval, and rotate the plurality of substrates, respectively, in a circumferential direction; a first, second, and third circulation groove that are disposed along outer peripheral portions of each of the plurality of substrates; a chemical solution supplier configured to supply a chemical solution to the outer peripheral portions of the plurality of substrates through the first circulation groove; a rinse solution supplier configured to supply a rinse solution to the outer peripheral portions of the plurality of substrates through the second circulation groove; and a fluid supplier configured to supply a fluid for drying the rinse solution to the outer peripheral portions of the plurality of substrates through the third circulation groove.
