18456623. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
Contents
- 1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Shingo Honda of Yokkaichi Mie (JP)
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18456623 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor device described in the abstract includes a first layer with a first recess portion on the upper surface and a second recess portion that extends from the bottom surface of the first recess portion in the first layer, with the second recess portion having a tapered shape.
- The first layer of the semiconductor device has a first recess portion on its upper surface.
- A second recess portion extends from the bottom surface of the first recess portion in the first layer.
- The second recess portion has a tapered shape, with a width in a first direction along the surface direction of the first layer reducing from the bottom surface of the first recess portion in a depth direction of the first layer.
Potential Applications
The technology described in this semiconductor device could be applied in:
- Microelectronics
- Semiconductor manufacturing
- Integrated circuits
Problems Solved
This technology helps in:
- Improving semiconductor device performance
- Enhancing manufacturing processes
- Increasing efficiency in electronic devices
Benefits
The benefits of this technology include:
- Enhanced functionality of semiconductor devices
- Improved reliability and durability
- Potential for smaller and more efficient electronic devices
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Consumer electronics
- Telecommunications
- Automotive industry
Possible Prior Art
One possible prior art for this technology could be:
- Previous semiconductor devices with recess portions for improved performance
Unanswered Questions
How does this technology impact energy consumption in electronic devices?
This article does not address the specific impact of this technology on energy consumption in electronic devices. Further research and analysis would be needed to determine the energy efficiency benefits of this semiconductor device.
What are the potential cost implications of implementing this technology in semiconductor manufacturing?
The article does not discuss the potential cost implications of implementing this technology in semiconductor manufacturing processes. A cost-benefit analysis would be necessary to understand the financial implications of adopting this innovation.
Original Abstract Submitted
A semiconductor device includes a first layer including a first recess portion on an upper surface; and a second recess portion that extends from a bottom surface of the first recess portion in the first layer, and the second recess portion has a tapered shape in which a width in a first direction along a surface direction of the first layer reduces from the bottom surface of the first recess portion in a depth direction of the first layer.
