18456533. EPOXY RESIN ADHESIVE FOR MEDICAL DEVICE AND CURED PRODUCT OF THE SAME, AND MEDICAL DEVICE MEMBER AND MEDICAL DEVICE simplified abstract (FUJIFILM Corporation)
EPOXY RESIN ADHESIVE FOR MEDICAL DEVICE AND CURED PRODUCT OF THE SAME, AND MEDICAL DEVICE MEMBER AND MEDICAL DEVICE
Organization Name
Inventor(s)
Kazushi Furukawa of Kanagawa (JP)
Yoshihiro Nakai of Kanagawa (JP)
EPOXY RESIN ADHESIVE FOR MEDICAL DEVICE AND CURED PRODUCT OF THE SAME, AND MEDICAL DEVICE MEMBER AND MEDICAL DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18456533 titled 'EPOXY RESIN ADHESIVE FOR MEDICAL DEVICE AND CURED PRODUCT OF THE SAME, AND MEDICAL DEVICE MEMBER AND MEDICAL DEVICE
Simplified Explanation
The abstract of the patent application describes an epoxy resin adhesive for a medical device and its cured product, as well as a medical device member and a medical device. The epoxy resin adhesive consists of three components (A) to (C).
- Component (A) is an epoxy resin.
- Component (B) is a curing agent for the epoxy resin.
- Component (C) is a filler material.
Potential applications of this technology:
- Medical devices requiring adhesive bonding.
- Bonding of medical device members.
Problems solved by this technology:
- Provides an epoxy resin adhesive specifically designed for medical devices.
- Ensures strong and durable bonding of medical device components.
Benefits of this technology:
- Enhanced adhesion strength.
- Improved durability and reliability of medical devices.
- Compatibility with medical device materials.
- Suitable for various medical device applications.
Original Abstract Submitted
Provided are an epoxy resin adhesive for a medical device and its cured product, and a medical device member and a medical device. The epoxy resin adhesive includes the following components (A) to (C):
