18454473. BUFFER FRAME MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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BUFFER FRAME MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Moohyun Baek of Suwon-si, Gyeonggi-do (KR)

Daeyoung Noh of Suwon-si, Gyeonggi-do (KR)

BUFFER FRAME MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18454473 titled 'BUFFER FRAME MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME

Simplified Explanation

The abstract describes an electronic device that includes a first surface plate, a second surface plate, and a frame module. The frame module encloses a space between the first and second surface plates and includes a bracket, an outer cover, and a buffer groove filled with a buffer member.

  • The electronic device includes a frame module that encloses a space between two surface plates.
  • The frame module consists of a bracket, an outer cover, and a buffer groove.
  • The bracket has a bracket end surface, while the outer cover has a first and second cover surface.
  • The buffer groove defines a space between the bracket end surface and a portion of the second cover surface.
  • The buffer groove is filled with a buffer member made of a buffer material.

Potential Applications:

  • This technology could be used in electronic devices such as smartphones, tablets, or laptops to provide structural support and protection.
  • It could also be applied in the automotive industry for designing and manufacturing electronic components in vehicles.

Problems Solved:

  • The frame module helps to protect the internal components of the electronic device from external impacts and damage.
  • It provides stability and structural integrity to the device, preventing flexing or bending.

Benefits:

  • The frame module enhances the durability and longevity of the electronic device.
  • It improves the overall user experience by ensuring the device remains intact and functional even under external stress or impact.
  • The buffer groove and buffer member help absorb shocks and vibrations, further protecting the device and its internal components.


Original Abstract Submitted

An electronic device includes: a first surface plate, a second surface plate positioned on a side opposite to the first surface plate, and a frame module including a frame enclosing at least a portion of a space formed between the first surface plate and the second surface plate. The frame module includes a bracket having a bracket end surface, an outer cover comprising a first cover surface and a second cover surface opposite to the first cover surface, and enclosing the bracket, and a buffer groove defining a space between the bracket end surface of the bracket and at least a portion of the second cover surface of the outer cover which face each other, and the buffer groove is filled with a buffer member comprising a buffer material.

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