18454220. SEMICONDUCTOR PACKAGE ASSEMBLY simplified abstract (MediaTek Inc.)
Contents
- 1 SEMICONDUCTOR PACKAGE ASSEMBLY
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE ASSEMBLY - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE ASSEMBLY
Organization Name
Inventor(s)
Che-Hung Kuo of Hsinchu City (TW)
Hsiao-Yun Chen of Hsinchu City (TW)
Wen-Pin Chu of Hsinchu City (TW)
Chun-Hsiang Huang of Hsinchu City (TW)
SEMICONDUCTOR PACKAGE ASSEMBLY - A simplified explanation of the abstract
This abstract first appeared for US patent application 18454220 titled 'SEMICONDUCTOR PACKAGE ASSEMBLY
Simplified Explanation
The semiconductor package assembly described in the abstract includes stacked semiconductor dies and a memory package connected to one of the dies. The first semiconductor die has interfaces that overlap and connect to the second semiconductor die, while also having an interface on one edge that connects to the memory package.
- Stacked semiconductor dies with overlapping interfaces
- Memory package connected to one of the semiconductor dies
Potential Applications
The technology described in this patent application could be used in various electronic devices such as smartphones, tablets, and computers where space-saving and efficient memory management are crucial.
Problems Solved
This technology solves the problem of efficiently connecting multiple semiconductor dies and a memory package in a compact and reliable manner.
Benefits
The benefits of this technology include increased memory capacity in a smaller footprint, improved data processing speed, and enhanced overall performance of electronic devices.
Potential Commercial Applications
- "Innovative Semiconductor Package Assembly for Enhanced Memory Management"
Possible Prior Art
One possible prior art for this technology could be the use of stacked semiconductor dies in electronic devices to increase memory capacity and improve performance.
Unanswered Questions
How does this technology impact the overall cost of manufacturing electronic devices?
The cost implications of implementing this technology in mass production are not addressed in the abstract. It would be interesting to know if this innovation leads to cost savings or increased production costs.
What are the environmental implications of using this technology in electronic devices?
The environmental impact of producing and disposing of electronic devices with this technology is not discussed. It would be important to consider the sustainability aspects of implementing this innovation.
Original Abstract Submitted
A semiconductor package assembly is provided. The semiconductor package assembly includes first semiconductor die, a second semiconductor die and a memory package. The first semiconductor die and the second semiconductor die are stacked on each other. The first semiconductor die includes a first interface and a third interface. The first interface overlaps and is electrically connected to the second interface arranged on the second semiconductor die. The third interface is arranged on a first edge of the first semiconductor die. The memory package is disposed beside the first semiconductor die, wherein the memory package is electrically connected to the first semiconductor die by the third interface.
