18450143. SEMICONDUCTOR PACKAGES INCLUDING AT LEAST ONE DIE POSITION CHECKER simplified abstract (SK hynix Inc.)
SEMICONDUCTOR PACKAGES INCLUDING AT LEAST ONE DIE POSITION CHECKER
Organization Name
Inventor(s)
Bok Gyu Min of Icheon-si Gyeonggi-do (KR)
Suk Won Lee of Icheon-si Gyeonggi-do (KR)
SEMICONDUCTOR PACKAGES INCLUDING AT LEAST ONE DIE POSITION CHECKER - A simplified explanation of the abstract
This abstract first appeared for US patent application 18450143 titled 'SEMICONDUCTOR PACKAGES INCLUDING AT LEAST ONE DIE POSITION CHECKER
Simplified Explanation
The abstract describes a semiconductor package that includes multiple dies stacked on top of each other. The package also includes a position checker that indicates the allowable range for the position of one of the dies.
- The semiconductor package includes multiple dies stacked on top of each other.
- The package substrate holds the dies in place.
- A position checker is included on the package substrate.
- The position checker indicates the allowable range for the position of one of the dies.
- The position checker helps ensure that the first die is located within the specified range.
Potential Applications
- Semiconductor manufacturing industry
- Electronics industry
- Integrated circuit packaging
Problems Solved
- Ensures proper positioning of dies in a semiconductor package
- Helps prevent misalignment or damage during assembly
Benefits
- Improved manufacturing efficiency
- Enhanced product reliability
- Reduced risk of assembly errors
Original Abstract Submitted
A semiconductor package may include a first die disposed on a package substrate, a second die stacked on the first die, and a first position checker disposed on the package substrate. The first position checker may indicate a first position allowable range in which a first side of the first die can be located.
