18449989. SEMICONDUCTOR DEVICES simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SEMICONDUCTOR DEVICES
SEMICONDUCTOR DEVICES
Organization Name
Inventor(s)
SEMICONDUCTOR DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18449989 titled 'SEMICONDUCTOR DEVICES
Simplified Explanation
The semiconductor device described in the abstract includes various components such as S/A circuit, bit lines, gate electrode, gate insulation pattern, channel, upper contact plug, and capacitor on a substrate. The device also features multiple lower contact plugs and wirings stacked between the S/A circuit and the bit lines, with different levels for the lower wirings.
- S/A circuit, bit lines, gate electrode, gate insulation pattern, channel, upper contact plug, and capacitor are present on the substrate.
- First, second, third, and fourth bit lines are arranged sequentially in the second direction.
- First lower contact plug, first lower wiring, and second lower contact plug are stacked between the S/A circuit and the first bit line.
- Third lower contact plug, second lower wiring, and fourth lower contact plug are stacked between the S/A circuit and the third bit line.
- First and second lower wirings are at different levels from each other.
Potential Applications
The technology described in this patent application could be applied in the manufacturing of advanced semiconductor devices for various electronic applications such as memory chips, processors, and sensors.
Problems Solved
This technology solves the problem of efficiently connecting the S/A circuit to multiple bit lines in a semiconductor device while maintaining different levels for the lower wirings.
Benefits
The benefits of this technology include improved performance, increased efficiency in data transfer, and enhanced reliability of semiconductor devices.
Potential Commercial Applications
Optimizing Lower Wirings in Semiconductor Devices for Enhanced Performance
Possible Prior Art
Prior art in the field of semiconductor device manufacturing may include similar techniques for connecting S/A circuits to multiple bit lines with different levels of wirings.
Unanswered Questions
How does this technology impact the overall cost of manufacturing semiconductor devices?
The abstract does not provide information on the cost implications of implementing this technology. Further research or analysis would be needed to determine the cost-effectiveness of this innovation.
What are the specific electronic devices that could benefit the most from this technology?
While the abstract mentions potential applications in memory chips, processors, and sensors, it does not specify which types of electronic devices could see the greatest improvements from this technology. Additional studies or case studies may be required to identify the most suitable applications.
Original Abstract Submitted
A semiconductor device includes a S/A circuit, bit lines, a gate electrode, a gate insulation pattern, a channel, an upper contact plug and a capacitor on a substrate. The bit lines includes first, second, third and fourth bit lines sequentially arranged in the second direction. A first lower contact plug, a first lower wiring and a second lower contact plug are sequentially stacked in a third direction between the S/A circuit and the first bit line, and are electrically connected to the S/A circuit and the first bit line. A third lower contact plug, a second lower wiring and a fourth lower contact plug are sequentially stacked in the third direction between the S/A circuit and the third bit line, and are electrically connected to the S/A circuit and the third bit line. The first and second lower wirings are at different levels from each other.
