18446900. SEMICONDUCTOR CHIP MOLDING DIE DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR CHIP MOLDING DIE DEVICE
Organization Name
Inventor(s)
Byeonggon Kim of Suwon-si (KR)
SEMICONDUCTOR CHIP MOLDING DIE DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18446900 titled 'SEMICONDUCTOR CHIP MOLDING DIE DEVICE
Simplified Explanation
The die device described in the patent application is used for molding semiconductor chips. It consists of a lower die with a moving plate that has V-groove structures to suction a release film coated with resin. There is also an upper die that can descend or ascend to close/open the dies. The upper die has suction vent units to suction a substrate on which the semiconductor chips are arranged. The lower die includes a device for manually adjusting the tension of a spring that supports the moving plate.
- The die device is designed to mold a plurality of semiconductor chips.
- The lower die has a moving plate with V-groove structures to suction a release film coated with resin.
- The upper die can descend or ascend to close/open the dies.
- The upper die has suction vent units to suction a substrate with semiconductor chips.
- The lower die includes a device for manually adjusting the tension of a spring that supports the moving plate.
Potential applications of this technology:
- Semiconductor manufacturing industry
- Electronics industry
Problems solved by this technology:
- Efficient molding of semiconductor chips
- Improved suctioning of release film coated with resin
- Precise adjustment of spring tension for better support
Benefits of this technology:
- Increased productivity in semiconductor manufacturing
- Enhanced quality control in chip molding process
- Improved reliability and durability of semiconductor devices
Original Abstract Submitted
A die device for molding a plurality of semiconductor chips is provided. The die device includes a lower die including a moving plate that has a plurality of V-groove structures for suctioning a release film coated with a resin, and an upper die which descends to the lower die or ascends from the lower die, thereby closing/opening the dies. The upper die includes at least a plurality of suction vent units for suctioning a substrate on which the semiconductor chips are arranged, and the lower die includes a device for manually adjusting the tension of a spring that supports the moving plate.
