18403686. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
- 1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.10.1 How does the different material composition of the first and second heat spreaders impact the overall thermal performance of the semiconductor device?
- 1.10.2 Are there any specific manufacturing processes or techniques mentioned in the patent application for integrating the first and second heat spreaders with the package structure?
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Shu-Shen Yeh of Taoyuan City (TW)
Po-Yao Lin of Hsinchu County (TW)
Po-Chen Lai of Hsinchu County (TW)
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18403686 titled 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The semiconductor device described in the patent application includes a package structure with a first heat spreader and a second heat spreader. The first heat spreader is positioned next to the package structure, while the second heat spreader is in direct contact with the first heat spreader and covers the top surface and sidewalls of the package structure. Importantly, the first heat spreader is made of a different material than the second heat spreader.
- The semiconductor device comprises a package structure, a first heat spreader, and a second heat spreader.
- The first heat spreader is adjacent to the package structure.
- The second heat spreader is in physical contact with the first heat spreader and covers the top surface and sidewalls of the package structure.
- The material of the first heat spreader differs from the material of the second heat spreader.
Potential Applications
The technology described in this patent application could be applied in various electronic devices that require efficient heat dissipation, such as computers, smartphones, and servers.
Problems Solved
1. Improved heat dissipation in semiconductor devices. 2. Enhanced thermal management in electronic systems.
Benefits
1. Increased performance and reliability of electronic devices. 2. Extended lifespan of semiconductor components. 3. Better overall thermal efficiency.
Potential Commercial Applications
Optimizing Heat Dissipation in Semiconductor Devices: A Key to Enhanced Performance
Possible Prior Art
There may be prior art related to heat spreaders and thermal management solutions in semiconductor devices, but specific examples are not provided in this patent application.
Unanswered Questions
How does the different material composition of the first and second heat spreaders impact the overall thermal performance of the semiconductor device?
The patent application does not delve into the specific thermal conductivity properties of the materials used for the heat spreaders and how they contribute to the device's heat dissipation capabilities.
Are there any specific manufacturing processes or techniques mentioned in the patent application for integrating the first and second heat spreaders with the package structure?
The patent application does not detail the manufacturing methods or processes involved in implementing the dual heat spreader design in semiconductor devices.
Original Abstract Submitted
A semiconductor device includes a package structure, a first heat spreader, and a second heat spreader. The first heat spreader is aside the package structure. The second heat spreader is in physical contact with the first heat spreader. The second heat spreader covers a top surface and sidewalls of the package structure. A material of the first heat spreader is different from a material of the second heat spreader.
