18403613. MODULAR PRESSURIZED WORKSTATION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

MODULAR PRESSURIZED WORKSTATION

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Chun-Jung Huang of Yunlin County (TW)

Yung-Lin Hsu of Hsin-Chu (TW)

Kuang Huan Hsu of Hsinchu City (TW)

Jeff Chen of New Taipei City (TW)

Steven Huang of Miaoli County (TW)

Yueh-Lun Yang of Hsinchu County (TW)

MODULAR PRESSURIZED WORKSTATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 18403613 titled 'MODULAR PRESSURIZED WORKSTATION

Simplified Explanation

The patent application describes a system for handling semiconductor workpieces within a workstation body, utilizing modular tools for processing and inspection.

• The system includes two pressurized load ports interfaced with the workstation body, allowing for the movement of semiconductor workpieces between them at a set pressure level.
• A first modular tool is connected to the first pressurized load port for processing the semiconductor workpiece, while a second modular tool connected to the second pressurized load port is used for inspecting the processed workpiece.

Potential Applications

The technology described in the patent application could be applied in semiconductor manufacturing facilities to streamline the processing and inspection of semiconductor workpieces.

Problems Solved

This system solves the problem of efficiently handling semiconductor workpieces within a controlled environment, ensuring proper processing and inspection without contamination.

Benefits

The benefits of this technology include improved efficiency, accuracy, and reliability in semiconductor manufacturing processes, leading to higher quality end products.

Potential Commercial Applications

A potential commercial application for this technology could be in the semiconductor industry, where precise processing and inspection of semiconductor workpieces are crucial for product quality.

Possible Prior Art

One possible prior art for this technology could be automated material handling systems in semiconductor manufacturing, but the specific configuration of modular tools for processing and inspection may be a novel aspect of this innovation.

How does this system handle potential variations in semiconductor workpiece sizes or shapes during processing and inspection?

The system's internal material handling system may be designed to accommodate different sizes or shapes of semiconductor workpieces, but the specifics of this adaptation are not detailed in the abstract.

What measures are in place to ensure the compatibility and interchangeability of the modular tools with the pressurized load ports in the workstation body?

While the abstract mentions the interface of the modular tools with the pressurized load ports, it does not elaborate on any specific mechanisms or standards used to ensure compatibility and interchangeability.

Original Abstract Submitted

In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.