18403560. SUBSTRATE AND PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
- 1 SUBSTRATE AND PACKAGE STRUCTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE AND PACKAGE STRUCTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SUBSTRATE AND PACKAGE STRUCTURE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Wei-Hung Lin of Xinfeng Township (TW)
Hsiu-Jen Lin of Zhubei City (TW)
Ming-Da Cheng of Taoyuan City (TW)
Yu-Min Liang of Zhongli City (TW)
Chen-Shien Chen of Zhubei City (TW)
SUBSTRATE AND PACKAGE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18403560 titled 'SUBSTRATE AND PACKAGE STRUCTURE
Simplified Explanation
The patent application describes a substrate with different pad sizes in different areas.
- The substrate has a first area and a second area.
- It includes multiple pads, with each pad having a specific size.
- The pad size in the first area is larger than the pad size in the second area.
Potential Applications
This technology could be applied in semiconductor manufacturing, specifically in the fabrication of integrated circuits where different pad sizes are required for various components.
Problems Solved
This innovation solves the issue of needing different pad sizes on a single substrate, allowing for more efficient and precise manufacturing processes.
Benefits
The benefits of this technology include improved functionality and performance of electronic devices, as well as potentially reducing production costs by optimizing the use of materials.
Potential Commercial Applications
- "Optimizing Pad Sizes in Semiconductor Manufacturing for Enhanced Performance"
Possible Prior Art
There may be prior art related to the optimization of pad sizes in semiconductor manufacturing processes, but specific examples are not provided in the patent application.
Unanswered Questions
How does this technology impact the overall efficiency of semiconductor manufacturing processes?
This technology could potentially streamline the manufacturing process by allowing for more precise control over pad sizes, but the exact impact on efficiency is not detailed in the patent application.
Are there any limitations to the scalability of this technology for mass production?
While the patent application describes the use of different pad sizes on a substrate, it does not address any potential limitations or challenges that may arise when scaling up production for commercial applications.
Original Abstract Submitted
According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.
