18402740. TESTING MODULE AND TESTING METHOD USING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
- 1 TESTING MODULE AND TESTING METHOD USING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 TESTING MODULE AND TESTING METHOD USING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
TESTING MODULE AND TESTING METHOD USING THE SAME
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Hao Chen of New Taipei City (TW)
TESTING MODULE AND TESTING METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18402740 titled 'TESTING MODULE AND TESTING METHOD USING THE SAME
Simplified Explanation
The testing module for a semiconductor wafer-form package described in the abstract includes a circuit board structure with connectors and bridge connectors for testing the package.
- Circuit board structure with edge regions and a main region
- First connectors connected to the circuit board structure over the edge regions
- First connecting structure located over and distant from the circuit board structure
- Second connectors and third connectors connected to the first connecting structure
- Third connectors transmit electric signals for testing the semiconductor wafer-form package
- First bridge connector electrically coupling the circuit board structure and the first connecting structure
Potential Applications
The technology described in this patent application could be used in the semiconductor industry for testing semiconductor wafer-form packages efficiently and accurately.
Problems Solved
This technology solves the problem of testing semiconductor wafer-form packages in a streamlined and effective manner, ensuring the reliability and quality of the packages.
Benefits
The benefits of this technology include improved testing processes, increased accuracy in testing results, and enhanced overall quality control in the semiconductor manufacturing process.
Potential Commercial Applications
- Semiconductor testing equipment manufacturing
- Semiconductor packaging companies
Possible Prior Art
One possible prior art for this technology could be similar testing modules used in the semiconductor industry for testing semiconductor packages.
Unanswered Questions
How does this technology compare to existing testing modules in terms of efficiency and accuracy?
The article does not provide a direct comparison between this technology and existing testing modules in terms of efficiency and accuracy.
What are the potential cost implications of implementing this technology in semiconductor manufacturing processes?
The article does not address the potential cost implications of implementing this technology in semiconductor manufacturing processes.
Original Abstract Submitted
A testing module for a semiconductor wafer-form package includes a circuit board structure, first connectors, a first connecting structure, second connectors, third connectors and a first bridge connector. The circuit board structure includes two edge regions and a main region located therebetween. The first connectors are located over the edge regions and connected to the circuit board structure. The first connecting structure is located over and distant from the circuit board structure. The second connectors and third connectors are located over and connected to the first connecting structure, where the third connectors are configured to transmit electric signals for testing the semiconductor wafer-form package being placed over the main region. The first bridge connector is electrically coupling the circuit board structure and the first connecting structure by connecting the second connectors and the first connectors.
