18402611. SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURFACES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
- 1 SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURFACES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURFACES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURFACES
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chiang-Jui Chu of Yilan County (TW)
Ching-Wen Hsiao of Hsinchu City (TW)
Ming-Da Cheng of Taoyuan City (TW)
Young-Hwa Wu of Tainan City (TW)
Tao-Sheng Chang of Tainan City (TW)
SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURFACES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18402611 titled 'SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURFACES
Simplified Explanation
The semiconductor package described in the abstract includes a conductive pillar with two different height sidewalls and solder hanging over both sidewalls of the pillar.
- The conductive pillar in the semiconductor package has a first sidewall and a second sidewall, with the first sidewall being taller than the second sidewall.
- The solder is directly in contact with the conductive pillar and hangs over both the first and second sidewalls of the pillar.
Potential Applications
This technology could be applied in:
- Semiconductor manufacturing
- Electronics assembly
Problems Solved
This technology helps in:
- Improving the connection between the conductive pillar and the solder
- Enhancing the reliability of the semiconductor package
Benefits
The benefits of this technology include:
- Better performance of the semiconductor package
- Increased durability and longevity
- Enhanced electrical conductivity
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Consumer electronics
- Automotive electronics
Possible Prior Art
There may be prior art related to:
- Soldering techniques in semiconductor packaging
- Conductive pillar structures in electronic devices
Unanswered Questions
How does this technology impact the overall cost of semiconductor packaging?
This article does not address the potential cost implications of implementing this technology in semiconductor packaging.
What are the environmental implications of using this technology in electronics manufacturing?
The article does not discuss the environmental impact of utilizing this technology in electronics manufacturing processes.
Original Abstract Submitted
A semiconductor package includes a conductive pillar and a solder. The conductive pillar has a first sidewall and a second sidewall opposite to the first sidewall, wherein a height of the first sidewall is greater than a height of the second sidewall. The solder is disposed on and in direct contact with the conductive pillar, wherein the solder is hanging over the first sidewall and the second sidewall of conductive pillar.
