View source for 18399220. ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES simplified abstract (Intel Corporation)

=ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES=


==Organization Name==

[[:Category:Intel Corporation|Intel Corporation]]


[[Category:Intel Corporation]]

==Inventor(s)==

[[:Category:Bernd Waidhas of Pettendorf (DE)|Bernd Waidhas of Pettendorf (DE)]][[Category:Bernd Waidhas of Pettendorf (DE)]]

[[:Category:Andreas Wolter of Regensburg (DE)|Andreas Wolter of Regensburg (DE)]][[Category:Andreas Wolter of Regensburg (DE)]]

[[:Category:Georg Seidemann of Landshut (DE)|Georg Seidemann of Landshut (DE)]][[Category:Georg Seidemann of Landshut (DE)]]

[[:Category:Thomas Wagner of Regelsbach (DE)|Thomas Wagner of Regelsbach (DE)]][[Category:Thomas Wagner of Regelsbach (DE)]]

==ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18399220 titled 'ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES

==Simplified Explanation==

The abstract describes an electronic package with multiple embedded dies and pads of different pitches, connected by a bridge die.

* The electronic package includes a mold layer with embedded dies and pads at different pitches.
* The first die has first and second pads at different pitches.
* The second die has third and fourth pads at different pitches.
* A bridge die electrically couples the second pads to the fourth pads.

== Potential Applications ==
This technology could be applied in:
* Consumer electronics
* Automotive industry
* Telecommunications

== Problems Solved ==
This technology helps in:
* Increasing integration density
* Improving electrical connections
* Enhancing overall performance

== Benefits ==
The benefits of this technology include:
* Enhanced functionality
* Improved reliability
* Cost-effective manufacturing

== Potential Commercial Applications ==
This technology could be commercially applied in:
* Mobile devices
* IoT devices
* Automotive electronics

== Possible Prior Art ==
There is no prior art known at this time.

== Unanswered Questions ==

=== How does the bridge die ensure proper electrical coupling between the different pads? ===
The bridge die likely contains conductive pathways that connect the second and fourth pads, ensuring proper electrical coupling.

=== What materials are typically used in the mold layer of electronic packages? ===
The mold layer is commonly made of epoxy resins or other thermosetting materials to provide insulation and protection for the embedded components.


==Original Abstract Submitted==

Embodiments disclosed herein include electronic package and methods of forming such packages. In an embodiment, an electronic package comprises a mold layer and a first die embedded in the mold layer. In an embodiment, the first die comprises first pads at a first pitch and second pads at a second pitch. In an embodiment, the electronic package further comprises a second die embedded in the mold layer, where the second die comprises third pads at the first pitch and fourth pads at the second pitch. In an embodiment, a bridge die is embedded in the mold layer, and the bridge die electrically couples the second pads to the fourth pads.



[[Category:H01L23/00]]
[[Category:H01L23/31]]
[[Category:H01L23/538]]