18399178. LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATION REMOVAL simplified abstract (Intel Corporation)

LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATION REMOVAL

Organization Name

Intel Corporation

Inventor(s)

Denis Myasishchev of Chandler AZ (US)

Andrew V. Mazur of Tempe AZ (US)

Purushotham Kaushik Muthur Srinath of Chandler AZ (US)

Robert M. Nickerson of Chandler AZ (US)

Shripad Gokhale of Gilbert AZ (US)

LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATION REMOVAL - A simplified explanation of the abstract

This abstract first appeared for US patent application 18399178 titled 'LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATION REMOVAL

Simplified Explanation

The abstract describes an electronic package with a mold layer, a die embedded in the mold layer, and a solder resist with cavities.

• The electronic package includes a mold layer and a die embedded within it.
• A solder resist with cavities is present on the mold layer.

Potential Applications

The technology described in this patent application could be applied in the following areas:

• Electronics manufacturing
• Semiconductor packaging

Problems Solved

This technology helps address the following issues:

• Protecting the die within the electronic package
• Ensuring proper insulation and connectivity

Benefits

The benefits of this technology include:

• Improved durability and reliability of electronic packages
• Enhanced protection for sensitive components

Potential Commercial Applications

The potential commercial applications of this technology could include:

• Consumer electronics
• Automotive electronics

Possible Prior Art

One possible prior art for this technology could be the use of solder resist in electronic packaging to protect components and ensure proper connectivity.

Unanswered Questions

What materials are used in the solder resist?

The abstract does not specify the materials used in the solder resist.

How are the cavities in the solder resist formed?

The abstract does not explain how the cavities in the solder resist are created.

Original Abstract Submitted

Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a mold layer and a die embedded in the mold layer. In an embodiment the electronic package further comprises a solder resist with a first surface over the mold layer and a second surface opposite from the first surface. In an embodiment, the second surface comprises a first cavity into the solder resist.