18397873. MICROELECTRONIC ASSEMBLIES simplified abstract (Intel Corporation)

From WikiPatents
Jump to navigation Jump to search

MICROELECTRONIC ASSEMBLIES

Organization Name

Intel Corporation

Inventor(s)

Adel A. Elsherbini of Tempe AZ (US)

Shawna M. Liff of Scottsdale AZ (US)

Johanna M. Swan of Scottsdale AZ (US)

Arun Chandrasekhar of Chandler AZ (US)

MICROELECTRONIC ASSEMBLIES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18397873 titled 'MICROELECTRONIC ASSEMBLIES

Simplified Explanation

The abstract describes a microelectronic assembly with a package substrate and a die secured to the substrate using non-solder interconnects.

  • Package substrate with first and second surfaces
  • Die with first and second surfaces, conductive contacts, and interconnects
  • First conductive contacts of the die connected to pathways in the package substrate using non-solder interconnects

Potential Applications

This technology could be applied in:

  • Consumer electronics
  • Automotive electronics
  • Medical devices

Problems Solved

This technology helps in:

  • Improving reliability of microelectronic assemblies
  • Enhancing electrical connectivity
  • Reducing the risk of solder-related issues

Benefits

The benefits of this technology include:

  • Increased durability
  • Enhanced performance
  • Cost-effective manufacturing process

Potential Commercial Applications

The potential commercial applications of this technology could be seen in:

  • Semiconductor industry
  • Telecommunications sector
  • Aerospace and defense

Possible Prior Art

One possible prior art could be the use of solder-based interconnects in microelectronic assemblies.

Unanswered Questions

How does this technology compare to traditional solder-based interconnects in terms of performance and reliability?

This article does not provide a direct comparison between non-solder interconnects and solder-based interconnects in terms of performance and reliability.

What are the specific materials used for the non-solder interconnects in this technology?

The article does not specify the exact materials used for the non-solder interconnects in this technology.


Original Abstract Submitted

Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface, and a die secured to the package substrate, wherein the die has a first surface and an opposing second surface, the die has first conductive contacts at the first surface and second conductive contacts at the second surface, and the first conductive contacts are coupled to conductive pathways in the package substrate by first non-solder interconnects.